Display Device

ABSTRACT

The present disclosure relates to a display device including an optical device, more specifically, it relates to a display device in which the optical device is positioned under the display panel so that the optical device is not exposed in the front direction. Even if the optical device is located under the display panel, the display device can normally perform the function of the optical device related to the front direction of the display panel and have a structure for this.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. Pat. Application No.16/929,797 filed on Jul. 15, 2020, which claims the benefit and priorityfrom Republic of Korea Patent Application No. 10-2019-0132471, filed inthe Republic of Korea on Oct. 23, 2019, each of which is herebyincorporated by reference in its entirety.

BACKGROUND Technical Field

The present disclosure relates to a display device.

Description of the Related Art

As the information society develops, demands for display devicesdisplaying images are increasing, and various types of display devicessuch as liquid crystal display devices, organic light emitting displaydevices, or quantum dot display devices are being used.

In addition, the display device provides an input method using a touchsensor or the like, and an optical device such as a camera and aproximity sensor to provide a variety of application functions to theuser. Due to this, there is a problem that the design of the displaydevice becomes difficult. In particular, since the camera and theproximity sensor are forced to be exposed to the outside for theentrance and exit of light, there is a problem in that the display areaof the display panel must be reduced.

Accordingly, in the related art, the front design of the display deviceis designed as a design having a large bezel for installation andexposure of the optical device, a design in which the display panel iscut out in a notch shape, or the optical device is displayed. There hasbeen a problem that is designed with a design that is exposed in theform of a hole in a part of the panel.

SUMMARY

An aspect of embodiments of the present disclosure is to provide adisplay device having a design in which an optical device requiringlight is not exposed to the outside at all.

Another aspect of embodiments of the present disclosure is to provide adisplay device including an optical device disposed to overlap thedisplay area under the display panel, wherein in a display device, theoptical devices are not exposed at all, and wherein the optical devicemay include one or more of a camera and a proximity sensor.

Another aspect of embodiments of the present disclosure is to provide adisplay device that does not degrade the performance of the opticaldevice while reducing the optical device from being exposed to theoutside at all.

Another aspect of embodiments of the present disclosure is to provide adisplay device having a structure that reduces the optical device frombeing exposed to the outside without deteriorating the performance anddisplay performance of the optical device.

Another aspect of embodiments of the present disclosure is to provide adisplay device capable of sensing fingerprints in all or part of thedisplay panel.

In accordance with an aspect of the present disclosure, there can beprovided a display device comprising: a transparent substrates; anoptical device positioned in a display area under the transparentsubstrate; a transistor array positioned in the display area over thetransparent substrate; an anode electrode layer positioned on thetransistor array; a light emitting layer positioned on the anodeelectrode layer; a heterogeneous cathode electrode layer positioned onthe light emitting layer and comprising a first cathode electrode and asecond cathode electrode, wherein the first cathode electrode overlapsthe optical device and is disposed in a first area which is a part ofthe display area, the second cathode electrode is disposed in a secondarea different from the first area in the display area, the firstcathode electrode has a first transmittance, and the second cathodeelectrode has a second transmittance lower than the first transmittance;and an encapsulation layer disposed on the heterogeneous cathodeelectrode layer.

The first cathode electrode may be a transparent electrode having thefirst transmittance equal to or greater than a predetermined thresholdtransmittance, and the second cathode electrode may be a translucentelectrode having the second transmittance less than the predeterminedthreshold transmittance. The predetermined threshold transmittance maybe a minimum transmittance that allows the functions of the camera andthe proximity sensor to be normally performed.

The display device may further comprise: a bank defining an emissionarea of each of a plurality of subpixels, wherein the bank positionedbetween the anode electrode layer on which an anode electrode disposedin each of the plurality of subpixels is located, and the heterogeneouscathode electrode layer; and a spacer disposed in a boundary areabetween the first area and the second area, and positioned on the bank,

A boundary point between the first cathode electrode and the secondcathode electrode may be on the spacer.

The first area may have a first resolution, the second area may have asecond resolution, and the first resolution may be lower than the secondresolution.

Subpixels disposed in the first area may constitute subpixel clustersincluding two or more subpixels,

A separation distance between the subpixel clusters may be greater thana separation distance between two or more subpixels included in each ofthe subpixel clusters.

The number of subpixels per unit area in the first area may be less thanthe number of subpixels per unit area in the second area, and whereinthe subpixel clusters in the first area may be regularly arranged.

In each of the subpixel clusters, the number of green subpixels may begreater than the number of blue subpixels and the number of redsubpixels.

The display device may further comprise: a touch sensor layer disposedon the encapsulation layer and including a plurality of touchelectrodes; a touch pad unit disposed on the transparent substrate andpositioned in a non-display area, which is an outer area of the displayarea; and a plurality of touch lines electrically connected to all orpart of the touch electrodes and descending along an inclined surface ofthe encapsulation layer to be electrically connected to the touch padunit positioned in the non-display area.

Each of the touch electrodes positioned in the first area among theplurality of touch electrodes may comprise a transparent electrode or amesh-type electrode having one or more openings.

The display device may further comprise: a polarizing plate disposed onthe touch sensor layer; an optical transparent adhesive disposed on thepolarizing plate; and a cover glass located on the optical transparentadhesive,

The polarizing plate may comprise a first portion corresponding to thefirst area and a second portion corresponding to the second area, andwherein the first portion may have a higher transmittance than thesecond portion.

The optical device may comprise a camera.

The display device may further comprising: a light generating device;and a proximity sensor detecting a surrounding human body or objectusing light emitted from the light generating device,

The optical device may further comprise the proximity sensor.

The light generating device may be located on the encapsulation layerand is located on the side of the touch sensor layer.

The light generating device may be located in a viewing area between theinclined surface of the encapsulation layer and the display area.

The proximity sensor may be located under the transparent substrate.

The proximity sensor may be positioned to overlap the first area.

The display device may further comprise a fingerprint sensor paneldisposed under the transparent substrate and including a plurality offingerprint sensor blocks, wherein the fingerprint sensor panel maycomprise a hole or notch groove positioned in a portion corresponding tothe first area.

The fingerprint sensor panel may comprise: a substrate disposed underthe transparent substrate and comprising the hole or notch groovepositioned in the portion corresponding to the first area; a fingerprinttransistor array disposed on the substrate and comprising transistorsdisposed in each of the plurality of fingerprint sensor blocks; apiezoelectric material layer disposed under the fingerprint transistorarray; a common electrode disposed under the piezoelectric materiallayer; a plurality of scan lines disposed on the substrate to transmitscan signals to a plurality of fingerprint sensor block rows; and aplurality of read-out lines disposed on the substrate to sense signalsfrom the plurality of fingerprint sensor block rows.

The fingerprint sensor panel may further comprise a plurality of scandriving blocks disposed on the substrate and disposed in an outer areaof the fingerprint sensor area where the fingerprint transistor array isdisposed on the substrate, wherein the plurality of scan driving blocksoutput the scan signals.

The plurality of scan driving blocks may comprise a first scan drivingblock located on one side and a second scan driving block located on theother side, based on the hole or notch groove in the substrate.

The plurality of scan lines may comprise one or more first scan linesfor transmitting scan signals output from the first scan driving blockto one or more fingerprint sensor block rows located at one side of thehole or notch groove, and one or more second scan lines for transmittingscan signals output from the second scan driving block to one or morefingerprint sensor block rows located at the other side of the hole ornotch groove.

The plurality of read-out lines may include at least one read-out linearranged in a column direction while bypassing the side of the hole ornotch groove.

The display device may further comprise: a touch driving circuitconfigured to generate touch sensing data through the touch electrodesand output the touch sensing data; a fingerprint driving circuitconfigured to generate fingerprint sensing data through the fingerprintsensor panel and output the fingerprint sensing data; and a processorconfigured to determine a touch location based on the touch sensing dataand recognize a fingerprint based on the fingerprint sensing data.

The fingerprint driving circuit may selectively drive one or morefingerprint sensor blocks corresponding to the touch position among theplurality of fingerprint sensor blocks included in the fingerprintsensor panel.

The plurality of fingerprint sensor blocks may be disposed to correspondto all areas except the first area in the display area.

The first area may be located in the display area, and is located at aboundary with a non-display area that is an outer area of the displayarea, and wherein only a part of the first area may be surrounded by thesecond area.

The first area may be located in the center of the display area, andwherein the first area may be surrounded by the second area in alldirections.

According to embodiments of the present disclosure, by arranging theoptical device under the display panel, it is possible to provide adisplay device having a design in which an optical device requiringlight reception is not exposed to the outside at all.

In addition, according to embodiments of the present disclosure, it ispossible to provide a display device in which one or more opticaldevices of a camera and a proximity sensor are disposed to overlap witha display area under a display panel. Accordingly, one or more opticaldevices can be reduced from being exposed to the outside of the displaydevice. Therefore, the user cannot visually identify one or more opticaldevices (or lenses thereof) of the camera and proximity sensor.

In addition, according to embodiments of the present disclosure, it ispossible to provide a display device that does not degrade theperformance of the optical device while reducing the optical device frombeing exposed to the outside at all.

In addition, according to embodiments of the present disclosure, it ispossible to provide a display device having a structure that reduces theoptical device from being exposed to the outside without deterioratingthe performance and display performance of the optical device.

In addition, according to embodiments of the present disclosure, it ispossible to provide a display device capable of sensing fingerprints inall or part of the display panel. Through this, various applicationsrelated to fingerprint recognition can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and advantages of the presentdisclosure will be more apparent from the following detailed descriptiontaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a view showing the display device according to embodiments ofthe present disclosure;

FIG. 2 is a view showing a screen configuration of the display deviceaccording to embodiments of the present disclosure;

FIG. 3 is a schematic cross-sectional view of the display deviceaccording to embodiments of the present disclosure;

FIG. 4 is a configuration diagram of a display part of the displaydevice according to embodiments of the present disclosure;

FIG. 5 is a configuration diagram of a touch sensing part and afingerprint sensing part of the display device according to embodimentsof the present disclosure;

FIG. 6 is an exemplary view illustrating a structure of the touch sensorin the display panel of the display device according to embodiments ofthe present disclosure;

FIG. 7 is another exemplary view of a structure of the touch sensor inthe display panel of the display device according to embodiments of thepresent disclosure;

FIG. 8 is another exemplary view of a structure of the touch sensor inthe display panel of the display device according to embodiments of thepresent disclosure;

FIG. 9 is a cross-sectional view of the display panel of the displaydevice according to embodiments of the present disclosure;

FIG. 10 is an exemplary view illustrating the touch electrode in thedisplay panel of the display device according to embodiments of thepresent disclosure;

FIG. 11 is a view showing the polarizing plate in the display panel ofthe display device according to embodiments of the present disclosure;

FIGS. 12 and 13 are views for explaining the position of the lightgenerating device for the proximity sensor in the display panel of thedisplay device according to embodiments of the present disclosure;

FIG. 14 is a view showing a heterogeneous cathode electrode layer of thedisplay device according to embodiments of the present disclosure;

FIGS. 15 and 16 are exemplary views illustrating arrangement structuresof subpixels in the first area and arrangement structures of subpixelsin the second area in the display panel of the display device accordingto embodiments of the present disclosure;

FIG. 17 is a cross-sectional view of a subpixel area in the second areain the display panel of the display device according to embodiments ofthe present disclosure;

FIG. 18 is a cross-sectional view of a subpixel area in the first areain the display panel of the display device according to embodiments ofthe present disclosure;

FIG. 19 is a cross-sectional view of a non-subpixel area in the firstarea in the display panel of the display device according to embodimentsof the present disclosure;

FIG. 20 is a view for explaining a principle of designing an area of thefirst area for a photographing function of the camera positioned underthe display panel in the display device according to embodiments of thepresent disclosure;

FIG. 21 is a cross-sectional view illustrating components of thefingerprint sensing part in the display device according to embodimentsof the present disclosure;

FIGS. 22 and 23 are plan views illustrating components of thefingerprint sensing part of the display device according to embodimentsof the present disclosure;

FIG. 24 is a view showing a scan driving of the fingerprint sensor panelof the display device according to embodiments of the presentdisclosure;

FIG. 25 is an example of an equivalent circuit of the fingerprintsensing pixel in the fingerprint sensor panel of the display deviceaccording to embodiments of the present disclosure;

FIG. 26 is a view showing driving electrodes, the piezoelectric materiallayer, and the common electrode in the fingerprint sensor panel of thedisplay device according to embodiments of the present disclosure;

FIGS. 27 to 29 are views exemplarily showing applications usingfull-area fingerprint sensing of the display device according toembodiments of the present disclosure; and

FIG. 30 is a diagram for describing local fingerprint sensing based ontouch sensing of the display device according to embodiments of thepresent disclosure.

DETAILED DESCRIPTION

In the following description of examples or embodiments of the presentdisclosure, reference will be made to the accompanying drawings in whichit is shown by way of illustration specific examples or embodiments thatcan be implemented, and in which the same reference numerals and signscan be used to designate the same or like components even when they areshown in different accompanying drawings from one another. Further, inthe following description of examples or embodiments of the presentdisclosure, detailed descriptions of well-known functions and componentsincorporated herein will be omitted when it is determined that thedescription may make the subject matter in some embodiments of thepresent disclosure rather unclear. The terms such as “including”,“having”, “containing”, “constituting” “make up of”, and “formed of”used herein are generally intended to allow other components to be addedunless the terms are used with the term “only”. As used herein, singularforms are intended to include plural forms unless the context clearlyindicates otherwise.

Terms, such as “first”, “second”, “A”, “B”, “(A)”, or “(B)” may be usedherein to describe elements of the present disclosure. Each of theseterms is not used to define essence, order, sequence, or number ofelements etc., but is used merely to distinguish the correspondingelement from other elements.

When it is mentioned that a first element “is connected or coupled to”,“contacts or overlaps” etc. a second element, it should be interpretedthat, not only can the first element “be directly connected or coupledto” or “directly contact or overlap” the second element, but a thirdelement can also be “interposed” between the first and second elements,or the first and second elements can “be connected or coupled to”,“contact or overlap”, etc. each other via a fourth element. Here, thesecond element may be included in at least one of two or more elementsthat “are connected or coupled to”, “contact or overlap”, etc. eachother.

When time relative terms, such as “after,” “subsequent to,” “next,”“before,” and the like, are used to describe processes or operations ofelements or configurations, or flows or steps in operating, processing,manufacturing methods, these terms may be used to describenon-consecutive or non-sequential processes or operations unless theterm “directly” or “immediately” is used together.

In addition, when any dimensions, relative sizes etc. are mentioned, itshould be considered that numerical values for an elements or features,or corresponding information (e.g., level, range, etc.) include atolerance or error range that may be caused by various factors (e.g.,process factors, internal or external impact, noise, etc.) even when arelevant description is not specified. Further, the term “may” fullyencompasses all the meanings of the term “can”.

FIG. 1 is a view showing the display device 10 according to embodimentsof the present disclosure.

The display device 10 according to embodiments of the present disclosurecan provide a function of displaying an image, a function of sensing atouch using a finger or a pen, and a function of sensing a fingerprint.

Referring to FIG. 1 , the display device 10 according to embodiments ofthe present disclosure may include a display panel 100 displaying animage and a case 200 protecting the display panel 100. In FIG. 1 , whena user views the front surface of the display device 10, a part of thecase 200 may be shown. In some cases, when the display device 10 isimplemented in a full-display type, when the user looks at the front ofthe display device 10, the case 200 may be invisible or almostinvisible, and only the display panel 100 may be visible. When the userlooks at the front of the display device 10, only the display area ofthe display panel 100 can be visible. In some cases, the display areaand a non-display area outside the display area (also referred to as abezel) can be viewed together.

Referring to FIG. 1 , the display device 10 according to embodiments ofthe present disclosure can sense a touch by a finger or a pen or thelike across the entire display area of the display panel 100, and sensea fingerprint across the entire display area of the display panel 100.That is, the display device 10 according to embodiments of the presentdisclosure can provide touch sensing and fingerprint sensing for allareas.

The display device 10 according to embodiments of the present disclosureincludes an optical device. For example, the optical device may includeone or more of a camera 110 for photographing and a proximity sensor 120for detecting a human body or an object approaching the surroundings.The camera 110 of the present specification may be a front camera thatphotographs the front surface of the display device 10.

When the display device 10 according to the embodiments of the presentdisclosure is viewed from the front, one or more optical devices of thecamera 110 and the proximity sensor 120 are not visible. To this end,the display device 10 according to embodiments of the present disclosurehas a structure in which one or more optical devices of the camera 110and the proximity sensor 120 may be positioned under the display panel100. In this specification, the camera 110 that is not exposed to theoutside and is located under display panel 100 is also referred to as anunder display camera (UDC). The display device 10 including the camera110 is referred to as a camera built-in display.

As described above, although the optical device is located under thedisplay panel 100, the display device 10 according to the embodiments ofthe present disclosure can normally perform a photographing function ofthe camera 110 and/or a proximity sensing function of the proximitysensor 120 through a unique structure. This will be described in detailbelow

FIG. 2 is a view showing a screen configuration of the display device 10according to embodiments of the present disclosure.

Referring to FIG. 2 , the display panel 100 can include a display areaAA in which an image is displayed and a non-display area NA which may bean outer area of the display area AA without displaying an image.

Referring to FIG. 2 , the display area AA may include a first area A1and a second area A2. The first area A1 may be a camera area, or mayoverlap all or part of the camera area or may include a camera area.Here, the camera area may be an area where the lens of the camera 110 islocated, and may also be referred to as a camera lens area or aphotographing area. In this specification, the camera 110 overlappingthe first area A1 may mean a camera lens. The first area A1 may be aproximity sensing area, or may overlap all or part of the proximitysensing area or may include a proximity sensing area. Here, theproximity sensing area may be an area capable of detecting an approachof an object or a human body by the proximity sensor 120.

For example, when a user grasps the display device 10 and photographshimself/herself, the user may shoot while looking at the first area A1.When the user covers the first area A1 with a face or a finger, thedisplay device 10 detects the proximity of the user’s face or fingerthrough the proximity sensor 120 and performs a predetermined operation(e.g., screen off, etc.) according to the detection result.

The first area A1 in the display area AA may be a path (light incidentpart) through which light enters the optical device. Here, the light maybe an electromagnetic file such as visible light, infrared light, orultraviolet light.

Referring to FIG. 2 , one or more optical devices of the camera 110 andthe proximity sensor 120 may be located under the first area A1. Thatis, one or more optical devices of the camera 110 and the proximitysensor 120 may overlap the first area A1.

FIG. 3 is a schematic cross-sectional view of the display device 10according to embodiments of the present disclosure.

Referring to FIG. 3 , the display device 10 according to embodiments ofthe present disclosure includes an optical device (e.g., camera 110,proximity sensor 120, etc.) positioned under the display panel 100 andoverlapping the display area AA. Nevertheless, the display device 10according to the embodiments of the present disclosure can normallyperform an intrinsic function (e.g., shooting function, light receivingfunction of the proximity sensor 120, etc.) of the optical device, andalso perform a display function normally. The display device 10according to the embodiments of the present disclosure has a structure(in particular, the structure in the first area A1) such that theoriginal function of the optical device is normally performed and thedisplay function is also normally performed.

Referring to FIG. 3 , the display device 10 according to embodiments ofthe present disclosure has a unique structure in a light incident partIA, which means a space in a panel through which light enters for thefunction of an optical device. The light incident part IA may bepositioned in the display area AA and may overlap with all or part ofthe first area A1.

Referring to FIG. 3 , the display device 10 according to embodiments ofthe present disclosure may include a transparent substrate 320, asubpixel forming unit 330, a heterogeneous cathode electrode layer 340,an encapsulation layer 350, and a touch sensor layer 360. The subpixelforming unit 330 may be positioned over the transparent substrate 320and may include subpixel patterns formed to form a plurality ofsubpixels SP. The heterogeneous cathode electrode layer 340 may bepositioned on the subpixel forming unit 330 and a cathode voltagecorresponding to a common voltage is applied. The encapsulation layer350 may be disposed on the heterogeneous cathode electrode layer 340 andhas an inclined surface at the outer side. The touch sensor layer 360may be disposed on the encapsulation layer 350 and may include aplurality of touch electrodes.

The subpixel forming unit 330 may include a transistor array 331, ananode electrode layer 332, a light emitting layer 333, and the like. Thetransistor array 331 may be positioned over the transparent substrate320 and may be located in the display area AA. The transistor array 331may include one or more transistors disposed in each of the plurality ofsubpixels. The anode electrode layer 332 may be disposed on thetransistor array 331 and may be disposed on each of a plurality ofsubpixels and may include an anode electrode electrically connected to asource node or a drain node of the corresponding transistor. The lightemitting layer 333 may be positioned on the anode electrode layer 332and may be positioned on the corresponding anode electrode in each ofthe plurality of subpixels.

The heterogeneous cathode electrode layer 340 may be positioned on thelight emitting layer 333. The anode electrode layer 332, the lightemitting layer 330, and the heterogeneous cathode electrode layer 340form a plurality of light emitting elements (e.g., OLED (organic lightemitting diode), etc.) for each subpixel.

The touch sensor layer 360 may include a plurality of touch electrodes,and may further include a plurality of touch lines electricallyconnected to all or part of the plurality of touch electrodes.

For example, the plurality of touch electrodes may be disposed on onelayer or may be divided and disposed on two or more layers separated byan insulating layer. The plurality of touch lines may be located on adifferent layer from the plurality of touch electrodes, or may belocated on the same layer as some of the plurality of touch electrodes.

The plurality of touch electrodes may be disposed in the display areaAA. Each of the plurality of touch lines may electrically connect acorresponding touch electrode positioned in the display area AA and apad part positioned in the non-display area NA. Accordingly, a pluralityof touch lines pass through the non-display area NA. The plurality oftouch lines may descend along the inclined surface of the encapsulationlayer 350 and be electrically connected to the pad portion.

Referring to FIG. 3 , the display device 10 according to embodiments ofthe present disclosure may further include a polarizing plate 370disposed on the touch sensor layer 360, an optical transparent adhesive380 disposed on the polarizing plate 370, and a cover glass 390 disposedon the optical transparent adhesive 380.

Referring to FIG. 3 , the display panel 100 may include the transparentsubstrate 320, the subpixel forming unit 330, the heterogeneous cathodeelectrode layer 340, the encapsulation layer 350, the polarizing plate370, the optical transparent adhesive 380, the cover glass 390 and thelike.

Referring to FIG. 3 , the display device 10 according to embodiments ofthe present disclosure may further include a fingerprint sensor panel300 positioned under the display panel 100. That is, the fingerprintsensor panel 300 may be located under the transparent substrate 320.

Referring to FIG. 3 , when present in the air layer between the displaypanel 100 and the fingerprint sensor panel 300, the fingerprint sensingperformance through the fingerprint sensor panel 300 may deteriorate orthe fingerprint sensing itself may not be possible. Accordingly, thedisplay panel 100 and the fingerprint sensor panel 300 may be bondedwith a bonding material so that the air layer does not exist between thedisplay panel 100 and the fingerprint sensor panel 300. For example, thebonding material may include resin, optical clear adhesive OCA, pressuresensitive adhesive PSA, or the like.

Referring to FIG. 3 , the display device 10 according to embodiments ofthe present disclosure may further include a back plate 310 positionedbetween the display panel 100 and the fingerprint sensor panel 300. Thedisplay panel 100 may be bonded to the top surface of the back plate310, and the fingerprint sensor panel 300 may be bonded to the bottomsurface of the back plate 310. Here, the back plate 310 may not be anessential configuration.

Referring to FIG. 3 , the display device 10 according to embodiments ofthe present disclosure further may include a cushion plate 306positioned under the fingerprint sensor panel 300 and protecting a lowerportion of the fingerprint sensor panel 300. The cushion plate 306 mayinclude a foam pad 302 and a metal plate 304 (made of copper (Cu) forexample) or the like.

Referring to FIG. 3 , the display device 10 according to embodiments ofthe present disclosure includes the optical device positioned in thedisplay area AA and disposed under the transparent substrate 320. Forexample, the optical device may include one or more of the camera 110and the proximity sensor 120.

Referring to FIG. 3 , the camera 110 and the proximity sensor 120 may belocated in the first area A1 in the display area AA. That is, the camera110 and the proximity sensor 120 may overlap the first area A1 in thedisplay area AA.

Referring to FIG. 3 , the light incident part IA may be a light path.More specifically, the light incident part IA may be a path throughwhich light (e.g., visible light) for photographing of the camera 110enters or exits, and light (e.g., infrared) for sensing by the proximitysensor 120 enters and exits. On a plane, the light incident part IA maycorrespond to the first area A1 or may be included in the first area A1.When viewed vertically, the light incident part IA may be an area fromthe cover class 390 corresponding to the front surface of the displaydevice 10 to the optical device.

The first area A1 may be a camera area (camera lens area) in which thelens of the camera 110 for photographing may be located, and may be aproximity sensing area capable of sensing an approach of an object or ahuman body.

Since the first area A1 may be the light incident part IA, light must bewell transmitted through the first area A1.

To this end, each of the layers 390, 380, 370, 360, 350, 340, 330, and310 located in the light incident part IA, which may be the lightincident path, may have a transmittance of more than a predeterminedthreshold transmittance. All or part (corresponding to the first areaA1) of each of the layers 390, 380, 370, 360, 350, 340, 330, and 310positioned in the light incident part IA may have a transmittance equalto or greater than the predetermined threshold transmittance. Thepredetermined threshold transmittance may be a minimum transmittancevalue that enables each function of the camera 110 and the proximitysensor 120. The term “transmittance” is also referred to as“transparency” in one embodiment. This will be described in more detailbelow.

Meanwhile, as illustrated in FIG. 2 , the first area A1 may be locatedin the display area AA, and may be located outside the display area AA.Alternatively, the first area A1 may be located in the display area AA,and may be located in the center of the display area AA. The first areaA1 may have a predetermined shape (e.g., polygons such as squares,hexagons, rounds, ovals, etc.) when viewed from over.

FIG. 4 is a configuration diagram of a display part of the displaydevice 10 according to embodiments of the present disclosure.

Referring to FIG. 4 , a display part of the display device 10 accordingto embodiments of the present disclosure may include a display panel 100in which a plurality of data lines DL, a plurality of gate lines GL, anda plurality of subpixel SP may be disposed, a data driving circuit 420for driving the plurality of data lines DL, a gate driving circuit 430for driving the plurality of gate lines GL, and a display controller 440for controlling the operation of the data driving circuit 420 and thegate driving circuit 430.

The data driving circuit 420 may supply the image data voltage Vdata tothe plurality of data lines DL according to the timing control of thedisplay controller 440. The gate driving circuit 430 may sequentiallysupply the scan signals SCAN to the plurality of gate lines GL accordingto the timing control of the display controller 440.

The plurality of data lines DL disposed in the display area AA of thedisplay panel 100 are electrically connected to the display pad unit 421located in the non-display area NA of the display panel 100. The datadriving circuit 420 is electrically connected to the display pad unit421.

The data driving circuit 420 may be implemented with a chip on film(COF) type, and may be mounted on a circuit film bonded to the displaypad unit 421 of the display panel 100. Alternatively, the data drivingcircuit 420 may be implemented in a COG (chip-on-glass) type or a COP(chip-on-panel) type, and may be directly mounted on the display padunit 421 of the display panel 100.

The gate driving circuit 430 may be implemented in a COF (chip-on-film)type, and may be mounted on a circuit film electrically connected to thedisplay panel 100. Alternatively, the gate driving circuit 430 may beimplemented in a COG (chip-on-glass) type or a COP (chip-on-panel) type,and may be mounted on the non-display area NA of the display panel 100.Alternatively, the gate driving circuit 430 may be implemented in a GIP(gate-in-panel) type to be formed in the non-display area NA of thedisplay panel 100.

The display device 10 according to embodiments of the present disclosuremay be a liquid crystal display (LCD) including a backlight unit.Alternatively, the display device 10 according to embodiments of thepresent disclosure may be a self-luminous display such as an organiclight emitting diode (OLED) display, a quantum dot display, or a microlight emitting diode (µLED) display.

When the display device 10 according to the embodiments of the presentdisclosure may be an OLED display, each subpixel SP may include anorganic light emitting diode (OLED) that emits light as a light emittingdevice. When the display device 10 according to the present exemplaryembodiments may be a quantum dot display, each subpixel SP may include alight emitting device made of quantum dots, which may be semiconductorcrystals that emit light themselves. When the display device 10according to the present embodiments may be a micro LED display, eachsub-pixel SP emits light itself and may include a micro LED (micro lightemitting diode) made of an inorganic material as a light emittingdevice.

In the display device 10 according to embodiments of the presentdisclosure, each subpixel SP may include a light-emitting device ED, adriving transistor DRT for controlling the current flowing through thelight emitting element ED, a scan transistor SCT for transferring theimage data voltage Vdata to the driving transistor DRT, and a storagecapacitor Cst for maintaining voltage for a certain period, and thelike.

The light emitting element ED may include an anode electrode AE and acathode electrode CE, and a light emitting layer EL positioned betweenthe anode electrode AE and the cathode electrode EC. For example, thelight emitting element ED may be an organic light emitting diode (OLED),a light emitting diode (LED), a quantum dot light emitting device, orthe like.

The cathode electrode CE of the light emitting element ED may be acommon electrode. In this case, a base voltage EVSS may be applied tothe cathode electrode CE of the light emitting element ED. Here, forexample, the base voltage EVSS may be a ground voltage or a voltagesimilar to the ground voltage.

The driving transistor DRT is a transistor for driving the lightemitting element ED, and may include a first node N1, a second node N2,and a third node N3.

The first node N1 of the driving transistor DRT may be a gate node ofthe driving transistor DRT, and may be electrically connected to asource node or a drain node of the scan transistor SCT. The second nodeN2 of the driving transistor DRT may be electrically connected to theanode electrode AE of the light emitting element ED, and may be a sourcenode or a drain node of the driving transistor DRT. The third node N3 ofthe driving transistor DRT may be electrically connected to a drivingvoltage line DVL that supplies the driving voltage EVDD, and may be adrain node or a source node of the driving transistor DRT.

The scan transistor SCT can control the connection between the firstnode N1 of the driving transistor DRT and the corresponding data line DLin response to the scan signal SCAN supplied from the gate line GL.

The drain node or the source node of the scan transistor SCT may beelectrically connected to the corresponding data line DL. The sourcenode or the drain node of the scan transistor SCT may be electricallyconnected to the first node N1 of the driving transistor DRT. The gatenode of the scan transistor SCT may be electrically connected to thegate line GL to receive a scan signal SCAN through the gate line GL.

When the scan transistor SCT is turned on by the scan signal SCAN of theturn-on level voltage, the scan transistor SCT may transfer the imagedata voltage Vdata supplied from the corresponding data line DL to thefirst node N1 of the driving transistor DRT.

The scan transistor SCT is turned on by the scan signal SCAN of theturn-on level voltage, and is turned off by the scan signal SCAN of theturn-off level voltage. Here, when the scan transistor SCT is n-type,the turn-on level voltage may be a high-level voltage, and the turn-offlevel voltage may be a low-level voltage. When the scan transistor SCTis p-type, the turn-on level voltage may be a low-level voltage and theturn-off level voltage may be a high-level voltage.

The storage capacitor Cst may be electrically connected between thefirst node N1 and the second node N2 of the driving transistor DRT. Thestorage capacitor Cst may maintain the image data voltage Vdatacorresponding to the image signal voltage or a voltage correspondingthereto for one frame time.

The storage capacitor Cst is an intentionally designed externalcapacitor, not a parasitic capacitor that is an internal capacitor(e.g., Cgs, Cgd) existing between the first node N1 and the second nodeN2 of the driving transistor DRT.

Each of the driving transistor DRT and the scan transistor SCT may be ann-type transistor or a p-type transistor. Both the driving transistorDRT and the scan transistor SCT may be n-type transistors or p-typetransistors. At least one of the driving transistor DRT and the scantransistor SCT may be an n-type transistor (or p-type transistor) andthe other may be a p-type transistor (or n-type transistor).

Each subpixel structure illustrated in FIG. 4 is only an example fordescription. Each subpixel may further include one or more transistorsand/or one or more capacitors. Each of the plurality of sub-pixels mayhave the same structure, or some of the plurality of sub-pixels may havea different structure.

FIG. 5 is a configuration diagram of a touch sensing part and afingerprint sensing part of the display device 10 according toembodiments of the present disclosure.

Referring to FIG. 5 , the display device 10 according to embodiments ofthe present disclosure may include a touch sensing part that senses atouch caused by a touch pointer or senses a touch position where thetouch pointer touches the display panel 100. Here, the touch pointer maybe a finger or a pen. When the touch pointer touches the display panel100, the touch pointer may touch the display panel 100 in a contactmanner, or the touch pointer may touch the display panel 100 in anon-contact manner (also called hover mode method). The touch sensingpart may include the display panel 100 with touch sensors, a touchdriving circuit 510 driving and sensing a touch sensor to output touchsensing data, and a processor 530 that recognizes a touch event oracquires a touch position using touch sensing data.

The touch sensor embedded in the display panel 100 may include aplurality of touch electrodes TE disposed in the touch sensing area TSAof the display panel 100. Here, the touch sensing area TSA maycorrespond to the display area AA.

The display panel 100 may include a plurality of touch electrodes TE anda plurality of touch lines TL. The display panel 100 may further includea touch pad unit 511 disposed in the non-display area NA andelectrically connected to the touch driving circuit 510. Each of theplurality of touch lines TL can electrically connect the correspondingtouch electrode TE among the plurality of touch electrodes TE to thetouch pad unit 511.

The touch pad unit 511 may be positioned on the transparent substrate320 and may be located in the non-display area NA, which may be an outerarea of the display area AA. The plurality of touch lines TL may beelectrically connected to all or part of the plurality of touchelectrodes TE. The plurality of touch lines TL may descend along theinclined surface of the encapsulation layer 350 and be electricallyconnected to the touch pad unit 511.

The touch driving circuit 510 may drive all or part of the plurality oftouch electrodes TE and sense all or part of the plurality of touchelectrodes TE to generate touch sensing data. The touch driving circuit510 may supply the generated touch sensing data to the processor 530.

The processor 530 may recognize a touch occurrence or determine a touchlocation based on the touch sensing data. The processor 530 may performa predetermined function (e.g., input processing, object selectionprocessing, writing processing, etc.) based on the recognized touchoccurrence or the determined touch position.

The touch driving circuit 510 and the data driving circuit 420 may beimplemented as separate integrated circuits. Alternatively, the touchdriving circuit 510 and the data driving circuit 420 may be integratedinto one integrated circuit.

Referring to FIG. 5 , a fingerprint sensing part of the display device10 according to embodiments of the present disclosure is a part forsensing a user’s fingerprint. The fingerprint sensing part may include afingerprint sensor panel 300 in which a plurality of fingerprint sensingpixels FP-PXL may be arranged, a fingerprint driving circuit 520 drivingand sensing the fingerprint sensor panel 300 to output fingerprintsensing data, and a processor 530 recognizing a fingerprint usingfingerprint sensing data and performing a predetermined function (e.g.,user authentication) according to a fingerprint recognition result.

The fingerprint sensing part of the display device 10 according toembodiments of the present disclosure may sense a fingerprint by anoptical method, an ultrasonic method, or the like. In the following, thefingerprint sensing part of the display device 10 may be an example ofsensing a fingerprint by an ultrasonic method.

The fingerprint sensing pixels FP-PXL included in the fingerprint sensorpanel 300 may be disposed in the fingerprint sensing area FSA. Here, thefingerprint sensing area FSA may correspond to the display area AA.

Each of the plurality of fingerprint sensing pixels FP-PXL may include apiezoelectric element, a driving unit (transmission unit), and a sensingunit (reception unit). The piezoelectric element may include a drivingelectrode, a piezoelectric material layer, and a common electrode. Thedriving unit drives the piezoelectric element to generate ultrasonicwaves in the piezoelectric element. The ultrasonic waves generated bythe piezoelectric element may be reflected from the fingerprint portion(ridge, valley) of the finger. The ultrasonic reflection characteristicsat the ridge and the ultrasonic reflection characteristics at the valleymay be different. The sensing unit generates a signal according to theultrasound waves reflected from the fingerprint portion of the finger,and senses the generated signal. Here, each of the driving unit(transmission unit) and the sensing unit (reception unit) may includeone or more switching elements (transistors).

A signal (AC signal) having a variable voltage level may be applied toone of the driving electrode and a common electrode, and a signal (DCsignal) having a constant voltage level may be applied to the other.

A fingerprint pad unit 521 to which the fingerprint driving circuit 520may be electrically connected may exist on the outer side of thefingerprint sensing area FSA of the fingerprint sensor panel 300.

The fingerprint sensor panel 300 may include a plurality of read-outlines RL that electrically connect each sensing unit (reception unit) ofthe plurality of fingerprint sensing pixels FP-PXL to the fingerprintpad unit 521.

The fingerprint driving circuit 520 may drive all or part of theplurality of fingerprint sensing pixels FP-PXL and sense all or part ofthe plurality of fingerprint sensing pixels FP-PXL. The fingerprintdriving circuit 520 may generate fingerprint sensing data according tothe sensing result, and supply the generated fingerprint sensing data tothe processor 530.

The processor 530 may recognize the fingerprint based on the fingerprintsensing data, and perform a predetermined function (e.g., userauthentication, etc.) according to the fingerprint recognition result.

Meanwhile, referring to FIG. 5 , the fingerprint sensor panel 300 mayhave a hole or notch groove 500 in a portion corresponding to the firstarea A1.

Hereinafter, the structure of the touch sensor in the display panel 100will be described with reference to FIGS. 6 to 10 . The display device10 according to embodiments of the present disclosure may sense a touchin a capacitance method.

FIG. 6 is an exemplary view illustrating a structure of the touch sensorin the display panel 100 of the display device 10 according toembodiments of the present disclosure.

Referring to FIG. 6 , each of the plurality of touch electrodes TEdisposed in the touch sensing area TSA of the display panel 100 may beseparated from each other and may be a block electrode. Each of theplurality of touch electrodes TE may not overlap each other.

Each of the plurality of touch electrodes TE may be electricallyconnected to the touch driving circuit 510 through one or more touchlines TL.

The touch line TL may be disposed in parallel with the data line DL orin the same direction as the data line DL.

The plurality of touch electrodes TE may include first and second touchelectrodes arranged in the same column. The first touch electrode may belocated farther from the touch driving circuit 510 than the second touchelectrode. The plurality of touch lines TL may include a first touchline connected to the first touch electrode and a second touch lineconnected to the second touch electrode.

The first touch line connected to the first touch electrode may overlapthe second touch electrode, but may not be electrically connected to thesecond touch electrode.

The first touch electrode and the second touch electrode may beseparated in the display panel 100 and may be physically separated. Thefirst touch line and the second touch line may be separated within thedisplay panel 100 and may be physically separated. The first touchelectrode and the second touch electrode may be separated in the displaypanel 100, but may be electrically connected by a switching circuit inthe touch driving circuit 510 depending on driving conditions.

The touch sensor structure illustrated in FIG. 6 may be suitable for aself-capacitance based touch sensing method that senses a touch using acapacitance between a touch electrode TE and a touch pointer (e.g.,finger, pen, etc.).

Accordingly, the touch driving circuit 510 supplies a touch drivingsignal to one or more of the plurality of touch electrodes TE, anddetects a touch sensing signal from the touch electrode TE to which thetouch driving signal may be applied. The touch driving circuit 510 mayacquire a sensing value for each touch electrode TE based on thedetection of the touch sensing signal, and generate touch sensing dataincluding the obtained sensing value.

FIG. 7 is another exemplary view of a structure of the touch sensor inthe display panel 100 of the display device 10 according to embodimentsof the present disclosure.

The touch sensor structure illustrated in FIG. 7 may be suitable for amutual-capacitance-based touch sensing method that senses a touch usinga capacitance between two touch electrodes TE.

Referring to FIG. 7 , for a touch sensing method based onmutual-capacitance, the plurality of touch electrodes TE disposed in thetouch sensing area TSA of the display panel 100 may include a pluralityof first touch electrodes X-TE and a plurality of second touchelectrodes Y-TE. The plurality of first touch electrodes X-TE and theplurality of second touch electrodes Y-TE may be disposed in differentdirections. Mutual-capacitance may be formed between the first touchelectrode X-TE and the second touch electrode Y-TE.

The plurality of first touch electrodes X-TE and the plurality of secondtouch electrodes Y-TE may cross each other. The point (area) at whichthe first touch electrode X-TE and the second touch electrode Y-TEintersect each other may be called a touch node.

The plurality of first touch electrodes X-TE may be driving electrodes(or transmitting electrodes) to which a touch driving signal is suppliedfrom the touch driving circuit 510, and the plurality of second touchelectrodes Y-TE may be sensing electrodes (or receiving electrodes)sensed by the touch driving circuit 510.

On the contrary, the plurality of first touch electrodes X-TE may besensing electrodes (or receiving electrodes) sensed by the touch drivingcircuit 510, and the plurality of second touch electrodes Y-TE may bedriving electrodes (or transmitting electrodes) to which a touch drivingsignal is supplied from the touch driving circuit 510.

FIG. 8 is another exemplary view of a structure of the touch sensor inthe display panel 100 of the display device 10 according to embodimentsof the present disclosure.

FIG. 8 is a touch sensor structure for mutual-capacitance based touchsensing and is an example different from FIG. 7 . However, the touchsensor structure of FIG. 8 is an electrical equivalent structure to thetouch sensor structure of FIG. 7 .

Referring to FIG. 8 , the plurality of touch electrodes TE disposed inthe touch sensing area TSA of the display panel 100 may include aplurality of first touch electrodes X-TE and a plurality of second touchelectrodes Y-TE. The first touch electrodes X-TE disposed in the samerow among the plurality of first touch electrodes X-TE may beelectrically connected by the first bridge pattern X-CL. The secondtouch electrodes Y-TE disposed in the same column among the plurality ofsecond touch electrodes Y-TE may be electrically connected by the secondbridge pattern Y-CL.

The first touch electrodes X-TE disposed in the same row and positionedon the same layer and the first bridge pattern X-CL connecting them maybe all integrally formed and may be located on the same layer.

The second touch electrodes Y-TE disposed in the same column andpositioned on the same layer, and the second bridge pattern Y-CLconnecting them, may be located on different layers and may beelectrically connected through contact holes.

The first touch electrodes X-TE disposed in the same row andelectrically connected by the first bridge pattern X-CL form one firsttouch electrode line X-TEL. The first touch electrode line X-TEL formedin this way may be electrically the same as the first touch electrodeX-TE in FIG. 7 . The second touch electrodes Y-TE disposed in the samecolumn and electrically connected by the second bridge pattern Y-CL formone second touch electrode line Y-TEL. The second touch electrode lineY-TEL formed as described above may be electrically the same as thesecond touch electrode Y-TE in FIG. 7 .

Each of the plurality of first touch electrode lines X-TEL may beelectrically connected to one or more first touch lines X-TL. Each ofthe plurality of second touch electrode lines Y-TEL may be electricallyconnected to one or more second touch lines Y-TL.

Each of the plurality of first touch electrode lines X-TEL may beelectrically connected to the first touch pad X-TP included in the touchpad unit 510 through one or more first touch lines X-TL. Each of theplurality of second touch electrode lines Y-TEL may be electricallyconnected to the second touch pad Y-TP included in the touch pad unit510 through one or more second touch lines Y-TL.

FIG. 9 is a cross-sectional view of the display panel 100 of the displaydevice 10 according to embodiments of the present disclosure.

The driving transistor DRT in each subpixel SP in the display area AAmay be disposed over the transparent substrate 320.

The driving transistor DRT may include a first node electrode NE1corresponding to a gate electrode, a second node electrode NE2corresponding to a source electrode or a drain electrode, and a thirdnode electrode NE3 corresponding to a drain electrode or a sourceelectrode. The driving transistor DRT further may include asemiconductor layer SEMI or the like.

The gate insulating layer GI may be positioned between the first nodeelectrode NE1 and the semiconductor layer SEMI. The first node electrodeNE1 and the semiconductor layer SEMI may overlap each other. The secondnode electrode NE2 may be formed on the insulating layer INS and may beconnected to one side of the semiconductor layer SEMI through a contacthole. The third node electrode NE3 may be formed on the insulating layerINS and may be connected to the other side of the semiconductor layerSEMI through a contact hole.

The light emitting element ED may include the anode electrode AEcorresponding to the pixel electrode, the light emitting layer EL formedon the anode electrode AE, and the cathode electrode CE formed on theemission layer EL and corresponding to the common electrode.

The anode electrode AE may be electrically connected to the second nodeelectrode NE2 of the driving transistor DRT exposed through the pixelcontact hole passing through the planarization layer PLN.

The emission layer EL may be formed on the anode electrode AE of theemission area provided (exposed) by the bank BANK. The light emittinglayer EL may have a stack structure including a hole related layer, alight emitting layer, and an electron related layer. The cathodeelectrode CE may be formed to face the anode electrode AE with the lightemitting layer EL interposed therebetween.

The light emitting element ED may be vulnerable to moisture or oxygen.The encapsulation layer 350 may prevent the light emitting element EDfrom being exposed to moisture or oxygen. That is, the encapsulationlayer 350 may reduce the penetration of moisture or oxygen. Theencapsulation layer 350 may be a single layer, but may be composed of aplurality of layers (PAS1, PCL, and PAS2) as shown in FIG. 9 .

For example, when the encapsulation layer 350 is composed of a pluralityof layers (PAS1, PCL, PAS2), the encapsulation layer 350 may include atleast one inorganic encapsulation layer (PAS1, PAS2) and at least oneorganic encapsulation layer PCL. As a specific example, theencapsulation layer 350 may have a structure in which the firstinorganic encapsulation layer PAS1, the organic encapsulation layer PCL,and the second inorganic encapsulation layer PAS2 may be sequentiallystacked.

Here, the organic encapsulation layer PCL may further include at leastone organic encapsulation layer or at least one inorganic encapsulationlayer.

The first inorganic encapsulation layer PAS1 may be disposed on thecathode electrode CE and may be disposed closest to the light emittingelement ED. The first inorganic encapsulation layer PAS1 may be formedof an inorganic insulating material capable of low-temperaturedeposition. For example, the first inorganic encapsulation layer PAS1may be silicon nitride (SiN_(x)), silicon oxide (SiO_(x)), siliconoxynitride (SiON), or aluminum oxide (Al₂O₃). Since the first inorganicencapsulation layer PAS1 may be deposited in a low temperatureatmosphere, during the deposition process, the first inorganicencapsulation layer PAS1 may reduce damage of the light emitting layerEL including the organic material due to vulnerability to a hightemperature atmosphere.

The organic encapsulation layer PCL may be formed with a smaller areathan the first inorganic encapsulation layer PAS1. In this case, theorganic encapsulation layer PCL may be formed to expose both ends of thefirst inorganic encapsulation layer PAS1. The organic encapsulationlayer PCL may serve as a buffer for alleviating stress between layersdue to bending of the touch display device, which is an organic lightemitting display device, and may also serve to enhance flatteningperformance. For example, the organic encapsulation layer PCL may beacrylic resin, epoxy resin, polyimide, polyethylene, or Siliconoxycarbon (SiOC), and may be formed of an organic insulating material.For example, the organic encapsulation layer PCL may be formed throughan inkjet method.

The display panel 100 may further include one or more dams (DAM1, DAM2)formed to prevent the encapsulation layer 350 from collapsing.

The one or more dams DAM1 and DAM2 may exist at or near the boundary ofthe display area AA and the non-display area NA. For example, the one ormore dams DAM1 and DMA2 may be located at or near the end point of theslope 900 of the encapsulation layer 350.

One or more dams DAM1 and DMA2 may be disposed between the touch padunit 511 including the touch pad Y-TP and the display area AA. The oneor more dams DAM1 and DMA2 may be formed of a dam forming pattern DFP orthe like. For example, the dam forming pattern DFP may include the samematerial as the bank BANK.

The one or more dams DAM1 and DMA2 may be located only in thenon-display area NA. Alternatively, most of the one or more dams DAM1and DMA2 exist in the non-display area NA, but a portion of the one ormore dams DAM1 and DMA2 may span the display area AA.

When the display panel 100 is formed with two or more dams (DAM1, DMA2)to reduce the likelihood of the sealing layer 350 from collapsing, thedam located closest to the display area AA may be called the primary damDAM1. After the primary dam, a dam located close to the display area AAmay be called a secondary dam DAM2. The primary dam DAM1 may bepositioned relatively closer to the display area AA than the secondarydam DAM2. The secondary dam DAM2 may be positioned relatively closer tothe touch pad unit 511 than the primary dam DAM1.

When the liquid form organic encapsulation layer PCL is dropped on thedisplay area AA, the liquid form organic encapsulation layer PCL maycollapse in the direction of the non-display area NA. The collapsedorganic encapsulation layer PCL may invade the pad area and cover thetouch pad unit 511 or the like. The collapse of the organicencapsulation layer PCL can be reduced by one or more dams (DAM1, DMA2).This may be larger when two or more dams DAM1 and DAM2 may be formed, asillustrated in FIG. 9 .

The primary dam DAM1 and/or the secondary dam DAM2 may be formed in asingle layer or multi-layer structure.

The primary dam DAM1 and/or the secondary dam DAM2 may be basically madeof a dam forming pattern DFP. The dam forming pattern DFP may have ahigher height than the touch pad Y-TP disposed on the touch pad unit511.

The dam formation pattern DFP may be formed of the same material as thebank BANK for separating the subpixels SP from each other, or may beformed of the same material as a spacer for maintaining the interlayerspacing. In this case, the dam formation pattern DFP may be formedsimultaneously with a bank BANK or a spacer. Accordingly, a damstructure can be formed without an additional mask and cost increase.

Referring to FIG. 9 , The primary dam DAM1 and/or the secondary dam DAM2has a multi-layer structure in which the first inorganic encapsulationlayer PAS1 and/or the second inorganic encapsulation layer PAS2 may bestacked on the dam formation pattern DFP.

The organic encapsulation layer PCL containing the organic material maybe located only on the inner side of the innermost primary dam DAM1.That is, the organic encapsulation layer PCL may not be present on alldams DAM1 and DAM2. Alternatively, the organic encapsulation layer PCLincluding an organic material may be positioned on at least the primarydam DAM1 of the primary dam DAM1 and the secondary dam DAM2. That is,the organic encapsulation layer PCL can be located extending to only theupper portion of the primary dam DAM1. Alternatively, the organicencapsulation layer PCL may be positioned to extend beyond the upperportion of the primary dam DAM1 to the upper portion of the secondarydam DAM2.

The second inorganic encapsulation layer PAS2 may be formed to cover thetop and side surfaces of the organic encapsulation layer PCL and thefirst inorganic encapsulation layer PAS 1 on the transparent substrate320 on which the organic encapsulation layer PCL may be formed. Thesecond inorganic encapsulation layer PAS2 can reduce or block externalmoisture or oxygen from penetrating into the first inorganicencapsulation layer PAS1 and the organic encapsulation layer PCL. Forexample, the second inorganic encapsulation layer PAS2 may be formed ofan inorganic insulating material such as silicon nitride (SiN_(x)),silicon oxide (SiO_(x)), silicon oxynitride (SiON), or aluminum oxide(Al₂O₃).

A touch buffer layer T-BUF may be disposed on the encapsulation layer350.

The first and second touch electrodes X-TE and Y-TE and the first andsecond bridge patterns X-CL and Y-CL may be positioned on the touchbuffer layer T-BUF.

All or part of each of the first and second touch lines X-TL and Y-TLmay also be positioned on the touch buffer layer T-BUF.

The touch buffer layer T-BUF may be positioned between the touchelectrodes X-TE and Y-TE and the cathode electrode CE. By the touchbuffer layer T-BUF, the separation distance between the touch electrodesX-TE and Y-TE and the cathode electrode CE of the light emitting elementED can be equal to or greater than a predetermined minimum separationdistance (e.g., 5 µm) or be a predetermined optimum separation distance.Accordingly, parasitic capacitance between the touch electrodes X-TE andY-TE and the cathode electrode CE may be reduced or prevented.Therefore, a decrease in touch sensitivity due to parasitic capacitancecan be reduced.

The touch buffer layer T-BUF may not be present on the encapsulationlayer 350. That is, the touch buffer layer T-BUF may not be disposedbetween the encapsulation layer 350 and the touch sensor metal layer.Here, the touch sensor metal layer may include first touch electrodesX-TE, second touch electrodes Y-TE, a first bridge pattern X-CL, asecond bridge pattern Y-CL, and the like.

In the manufacturing process of the touch sensor metal, chemicals(developer or etchant, etc.) used in the process or moisture from theoutside may occur. By arranging the touch buffer layer T-BUF anddisposing a touch sensor metal thereon, it may be possible to reducepenetration of the chemical liquid or moisture into the light emittinglayer EL containing the organic material during the manufacturingprocess of the touch sensor metal. Accordingly, the touch buffer layerT-BUF can reduce damage to the light emitting layer EL, which may besusceptible to chemicals or moisture.

The touch buffer layer T-BUF may be formed of an organic insulatingmaterial having a low dielectric constant (e.g., 1 ~ 3 dielectricconstant) and formed at a low temperature below a certain temperature(e.g., 100 degrees (°C)) in order to reduce damage to the light emittinglayer EL containing an organic material vulnerable to high temperatures.For example, the touch buffer layer T-BUF may be formed of anacrylic-based, epoxy-based, or siloxane-based material. As the organiclight emitting display device is bent, each encapsulation layer (PAS1,PCL, PAS2) in the encapsulation layer 350 may be damaged, and the touchsensor metal positioned on the touch buffer layer T-BUF may be broken.Even if the organic light emitting display device is bent, the touchbuffer layer T-BUF having a flattening performance with an organicinsulating material may prevent damage to the encapsulation layer 350and/or cracks in the touch sensor metal.

According to the mutual-capacitance-based touch sensor structure, thefirst touch electrode line X-TEL and the second touch electrode lineY-TEL may be disposed on the touch buffer layer T-BUF, and the firsttouch electrode line X-TEL and the second touch electrode line Y-TEL maybe arranged to cross.

The second touch electrode line Y-TEL may include a plurality of secondtouch electrodes Y-TE. The second touch electrode line Y-TEL may furtherinclude a plurality of second bridge patterns Y-CL that electricallyconnect the plurality of second touch electrodes Y-TE. As illustrated inFIG. 9 , the plurality of second touch electrodes Y-TE and the pluralityof second bridge patterns Y-CL may be positioned on different layerswith the touch insulating layer ILD therebetween.

Referring to FIGS. 8 and 9 together, the plurality of second touchelectrodes Y-TE disposed in the same column may be spaced apart atregular intervals along the y-axis direction (column direction). Each ofthe plurality of second touch electrodes Y-TE may be electricallyconnected to another second touch electrode Y-TE adjacent in the y-axisdirection through the second bridge pattern Y-CL.

The second bridge pattern Y-CL may be formed on the touch buffer layerT-BUF. The second bridge pattern Y-CL may be exposed through a touchcontact hole passing through the touch insulating layer ILD andelectrically connected to two second touch electrodes Y-TE adjacent inthe y-axis direction.

The second bridge pattern Y-CL may be disposed to overlap the bank BANK.Accordingly, it may be possible to prevent the aperture ratio from beinglowered by the second bridge pattern Y-CL.

Referring to FIGS. 8 and 9 together, the first touch electrode lineX-TEL may include a plurality of first touch electrodes X-TE. The firsttouch electrode line X-TEL may further include a plurality of firstbridge patterns X-CL that electrically connect the plurality of firsttouch electrodes X-TE. The plurality of first touch electrodes X-TE andthe plurality of first bridge patterns X-CL may be positioned ondifferent layers with the touch insulating layer ILD therebetween.Alternatively, the plurality of first bridge patterns X-CL and theplurality of first touch electrodes X-TE may be integrally formed andmay be located on the same layer.

Referring to FIGS. 8 and 9 together, the plurality of first touchelectrodes X-TE disposed in the same row may be spaced apart at regularintervals along the x-axis direction (row direction) on the touchinsulating layer ILD. Each of the plurality of first touch electrodesX-TE may be electrically connected to another first touch electrode X-TEadjacent in the x-axis direction through the first bridge pattern X-CL.

The first bridge pattern X-CL may be disposed on the same plane as thefirst touch electrode X-TE and may be electrically connected to twofirst touch electrodes X-TE adjacent in the x-axis direction without aseparate contact hole. Alternatively, the first bridge pattern X-CL maybe integral with two first touch electrodes X-TE adjacent in the x-axisdirection.

The first bridge pattern X-CL may be disposed to overlap the bank BANK.Accordingly, it may be possible to reduce the aperture ratio from beinglowered by the first bridge pattern X-CL.

Referring to FIG. 9 , the second touch electrode line Y-TEL can beelectrically connected to the second touch pad Y-TP included in touchpad unit 511 in the first non-display area NA1 through the second touchline Y-TL. The second touch pad Y-TP may be electrically connected tothe touch driving circuit 510.

Similar to this structure, the first touch electrode line X-TEL can beelectrically connected to the first touch pad X-TP included in touch padunit 511 in the first non-display area NA1 through the first touch lineX-TL. The first touch pad X-TP may be electrically connected to thetouch driving circuit 510.

The touch pad unit 511 may further include a pad cover electrodecovering the first touch pad X-TP and the second touch pad Y-TP.

The first touch pad X-TP may be formed separately from the first touchline X-TL or may be formed by extending the first touch line X-TL. Thesecond touch pad Y-TP may be formed separately from the second touchline Y-TL or may be formed by extending the second touch line Y-TL.

When the first touch pad X-TP is formed by extending the first touchline X-TL, and the second touch pad Y-TP is formed by extending thesecond touch line Y-TL, the first touch pad X-TP, the first touch lineX-TL, the second touch pad Y-TP, and the second touch line Y-TL mayinclude the same one or more first conductive materials and may beformed in a single layer or multilayer structure. For example, the firstconductive material may include Al, Ti, Cu, Mo, and the like, and may bea metal having strong corrosion resistance, strong acid resistance, andgood conductivity.

For example, each of the first touch pad X-TP, the first touch lineX-TL, the second touch pad Y-TP, and the second touch line Y-TL mayinclude the first conductive materials, and may be formed of athree-layer stacked structure, such as Ti / Al / Ti or Mo / Al / Mo.

The pad cover electrode capable of covering the first touch pad X-TP andthe second touch pad Y-TP may include one or more second conductivematerials. The second conductive material may include a transparentconductive material (e.g., ITO, IZO, etc.) having strong corrosionresistance and strong acid resistance. The pad cover electrode may beformed to be exposed by the touch buffer layer T-BUF to be bonded to thetouch driving circuit 510 or to a circuit film on which the touchdriving circuit 510 may be mounted. The second conductive material mayalso be included in the first and second touch electrodes X-TE and Y-TE.

The touch buffer layer T-BUF may be formed to cover the touch sensormetal the encapsulation layer 350, thereby preventing the touch sensormetal the light emitting elements (e.g., OLED (Organic Light EmittingDiode), etc.) under the encapsulation layer 350 from being corroded bymoisture or the like. For example, the touch buffer layer T-BUF may beformed of an organic insulating material, or may be formed of a circularpolarizing plate or a film of epoxy or acrylic material. The touchbuffer layer T-BUF may not be on the encapsulation layer 350. That is,the touch buffer layer T-BUF may not be an essential configuration.

The second touch line Y-TL may be electrically connected to the secondtouch electrode Y-TE through a contact hole, or may be integrally formedwith the second touch electrode Y-TE.

The second touch line Y-TL electrically connects the second touchelectrode Y-TE of the display area AA and the second touch pad Y-TP ofthe first non-display area NA1. A line portion of the second touch lineY-TL extended to the first non-display area NA1 may include a first lineportion disposed along the inclined surface 900 of the encapsulationlayer 350, a second line portion disposed on the one or more dams DAM1and DAM2, and a third line portion electrically connected to the secondtouch pad Y-TP in the touch pad portion 511. The third line portion maybe electrically connected to the touch driving circuit 510 through thesecond touch pad Y-TP. The first line portion may be closest to thedisplay area AA, and the third line portion may be farthest from thedisplay area AA.

The second touch line Y-TL may transfer a touch sensing signal from thesecond touch electrode Y-TE to the touch driving circuit 510 or maytransfer the touch driving signal received from the touch drivingcircuit 510 to the second touch electrode Y-TE.

The first touch line X-TL may be electrically connected to the firsttouch electrode X-TE through a contact hole, or may be integrally formedwith the first touch electrode X-TE.

The first touch line X-TL electrically connects the first touchelectrode X-TE in the display area AA and the first touch pad X-TP inthe first non-display area NA1. A line portion of the first touch lineX-TL extended to the first non-display area NA1 may include a first lineportion disposed along the inclined surface 900 of the encapsulationlayer 350, a second line portion disposed on the one or more dams DAM1and DAM2, and a third line portion electrically connected to the firsttouch pad X -TP in the touch pad portion 511. The third line portion maybe electrically connected to the touch driving circuit 510 through thefirst touch pad X-TP. The first line portion may be closest to thedisplay area AA, and the third line portion may be farthest from thedisplay area AA.

The first touch line X-TL may transfer the touch driving signal receivedfrom the touch driving circuit 510 to the first touch electrode X-TE ormay transfer a touch sensing signal from the first touch electrode X-TEto the touch driving circuit 510.

The arrangement of the first touch line X-TL and the second touch lineY-TL can be variously changed according to the panel design.

A touch protection layer PAC may be disposed on the first touchelectrode X-TE and the second touch electrode Y-TE. The touch protectionlayer PAC may be extended to before or after the one or more dams DAM 1and DAM2, and may be disposed on the first touch line X-TL and thesecond touch line Y-TL.

Meanwhile, the cross-sectional view of FIG. 9 conceptually shows thestructure, depending on the viewing direction or location, the position,thickness, or width of each pattern (various layers or variouselectrodes) may be changed, and the connection structure of variouspatterns may also be changed. In addition to the various layers shown,there may be additional layers, some of the various layers shown may beomitted or integrated. For example, the width of the bank BANK may benarrow compared to the width represented in FIG. 9 , and the heights ofthe dams DAM1 and DAM2 may be lower or higher than the heightsillustrated in FIG. 9 .

FIG. 10 is an exemplary view illustrating the touch electrode TE in thedisplay panel 100 of the display device 10 according to embodiments ofthe present disclosure.

Referring to FIG. 10 , each of the touch electrodes TE positioned in thefirst area A1 among the touch electrodes TE disposed inside the displaypanel 100 may be a mesh-type electrode having one or more openings or amesh-type electrode. Each of the touch electrodes TE positioned in thefirst area A1 among the touch electrodes TE may be a transparentelectrode or may include a transparent electrode.

As described above, since the touch electrode TE positioned in the firstarea A1 may be a mesh type or formed of a transparent electrode, thetransmittance of the first area A1 may be increased. Accordingly, ashooting function of the camera 110 through the first area A1 and asensing function of the proximity sensor 120 through the first area A1may be enabled.

One touch electrode TE may be a transparent electrode without an opening(open area).

Alternatively, one touch electrode TE may be a mesh type having aplurality of open areas OA. That is, one touch electrode TE may be anelectrode metal EM patterned in a mesh type to have a plurality of openareas OA. Here, the electrode metal EM may be one of the touch sensormetals.

Each of the plurality of open areas OA present on one touch electrode TEmay correspond to the emission area of one or more subpixels SP. Thatis, the plurality of open areas OA serves as a path through which lightemitted from the plurality of subpixels SP disposed under the touchelectrode TE passes upward. The plurality of open areas OA present ineach touch electrode TE disposed in the first area A1 may furtherimprove transmittance in the first area A1.

In the touch electrode TE, the actual electrode part (that is, theelectrode metal EM) excluding the plurality of open areas OA may bepositioned on the bank BANK.

The method of forming the multiple touch electrodes TE is as follows.After the electrode metal EM is broadly formed in a mesh type in an areafor forming a plurality of touch electrodes TE, the electrode metal EMis cut along a predetermined cutting line. Here, the predeterminedcutting line corresponds to a boundary of a plurality of touchelectrodes TE to be formed. After the cutting process, a plurality ofseparated electrode metals EM may be formed as a plurality of touchelectrodes TE.

For example, the outer shape of the touch electrode TE may be a diamondshape, a rhombus shape, or a square shape, or may be various shapes suchas a triangle, pentagon, or hexagon. The outer shape of the touchelectrode TE is not limited to these examples and may be various shapes.

Referring to FIG. 10 , in the area occupied by the mesh type touchelectrode TE, one or more dummy metals DM may exist in a form separatedfrom the mesh type electrode metal EM.

The electrode metal EM may be an electrode portion corresponding to theactual touch electrode TE, and may be an electrode where a touch drivingsignal may be applied or a touch sensing signal may be sensed. However,although the dummy metal DM may be present in the area of the touchelectrode TE, the dummy metal DM may be a floating metal part in whichthe touch driving signal may not be applied and the touch sensing signalmay not be detected. That is, the dummy metal DM may be an electricallyfloating and isolated metal.

Therefore, the electrode metal EM may be electrically connected to thetouch driving circuit 510, but the dummy metal DM may not beelectrically connected to the touch driving circuit 510.

In each area of all the touch electrodes TE, one or more dummy metals DMmay exist in a state of being disconnected from the electrode metals EM.Alternatively, the one or more dummy metals DM may exist only in an areaof some touch electrodes TE of all touch electrodes TE, and may notexist in areas of other touch electrodes TE.

Meanwhile, in relation to the role of dummy metal DM, when one or moredummy metals DM do not exist in the area of the touch electrode TE andonly the electrode metal EM exists in a mesh type, visibility issues inwhich the outline of the electrode metal EM may be displayed on thescreen may occur.

In comparison, when one or more dummy metals DM are present in the areaof the touch electrode TE, visibility issues in which the outline of theelectrode metal EM may be displayed on the screen may be prevented.

In addition, for each touch electrode TE, by controlling the existenceor number of dummy metal DMs (dummy metal ratio), the effectiveelectrode area that affects the size of the mutual-capacitance for eachtouch electrode TE may be adjusted. Through this, the size of themutual-capacitance between the first touch electrode X-TE and the secondtouch electrode Y-TE may be adjusted to improve touch sensitivity.

On the other hand, by cutting some points from the electrode metal EMformed in the area of one touch electrode TE, the electrode metal partsfalling off the original electrode metal EM can form the dummy metal DM.Therefore, the electrode metals EM and the dummy metal DM may be thesame material formed on the same layer.

FIG. 11 is a view showing the polarizing plate 370 in the display panel100 of the display device 10 according to embodiments of the presentdisclosure.

Referring to FIG. 11 , the polarizing plate 370 in the display panel 100of the display device 10 according to embodiments of the presentdisclosure may include a first portion POL1 corresponding to the firstarea A1 and a second portion POL2 corresponding to the second area A2.

In the polarizing plate 370, the first portion POL1 may have a highertransmittance than the second portion POL2. The first portion POL1 mayhave a transmittance equal to or greater than a predetermined thresholdtransmittance. The second portion POL2 may have a transmittance lessthan a predetermined threshold transmittance. Here, the predeterminedthreshold transmittance may be a minimum transmittance that allows thefunctions of each of the camera 110 and the proximity sensor 120 to benormally performed.

As described above, since the first portion POL1 of the polarizing plate370 may be formed with a high transmittance, the transmittance of thefirst area A1 corresponding to the first portion POL1 of the polarizingplate 370 may be increased. Accordingly, the shooting function of thecamera 110 through the first area A1 and the sensing function of theproximity sensor 120 through the first area A1 may be normallyperformed.

Each of the optical transparent adhesive 380 and the cover glass 390positioned on the polarizing plate 370 may have a transmittance equal toor greater than the predetermined threshold transmittance. Here, thepredetermined threshold transmittance may be a minimum transmittancethat allows the functions of each of the camera 110 and the proximitysensor 120 to be normally performed.

FIGS. 12 and 13 are views for explaining the position of the lightgenerating device 1200 for the proximity sensor 120 in the display panel100 of the display device 10 according to embodiments of the presentdisclosure.

Referring to FIGS. 12 and 13 , the display device 10 according toembodiments of the present disclosure may include a proximity sensor 120that detects whether a human body or object is in proximity. Theproximity sensor 120 may detect whether a human body or an object is inclose proximity by receiving light (e.g., infrared rays) flowing intothe light incident part IA.

The display device 10 according to embodiments of the present disclosuremay further include a light generating device 1200 that generates light(e.g., infrared light). The proximity sensor 120 may detect a nearbyhuman body or object using light emitted from the light generatingdevice 1200.

When the light generating device 1200 generates light, light generatedby the light generating device 1200 and emitted to the outside isreflected by a human body or an object proximate to the display device10. The reflected light flows into the light incident part IAcorresponding to the first area A1 of the display device 10.

Since the proximity sensor 120 is located under the display panel 100,but is located in the first area A1 in the display area AA, theproximity sensor 120 may receive light flowing into the light incidentpart IA corresponding to the first area A1. The proximity sensor 120 maydetect whether a human body or an object is in proximity based on thelight received through the light incident part IA. The proximity sensor120 may be viewed as including a light generating device 1200.

Referring to FIGS. 12 and 13 , the light generating device 1200 may belocated on the encapsulation layer 350 and may be located on the side ofthe touch sensor layer 360. For example, the light generating device1200 may be located on any one of the upper left side, upper right side,lower left side, or lower right side of the touch sensor layer 360. Thelight generating device 1200 may be located at one corner of the displaypanel 100.

Referring to FIG. 13 , the area between the point where the display areaAA ends and the point where the inclined surface 900 of theencapsulation layer 350 starts may be referred to as a viewing area VA.The light generating device 1200 may be positioned on the encapsulationlayer 350, but may be located in the viewing area VA between theinclined surface 900 of the encapsulation layer 350 and the display areaAA.

With respect to the seating structure of the light generating device1200, one or more pads 1311 may be disposed at one or more points on theflattened surface of the encapsulation layer 350 in the viewing area VA.One or more bumpers 1313 may be bonded to one or more pads 1311 by thebonding agent 1312. The light generating device 1200 may be mounted onone or more bumpers 1313.

The uppermost point of the light generating device 1200 may be lowerthan the uppermost point of the polarizing plate 370 formed on the touchsensor layer 360. Therefore, an upper space 1314 may exist on the lightgenerating device 1200. The touch sensor layer 360 includes touch sensormetals including the first touch electrode X-TE, the second touchelectrode Y-TE, the first bridge pattern X-CL, and the second bridgepattern Y-CL. Some (e.g., second bridge pattern Y-CL) of the touchsensor metals are disposed on the first touch sensor metal layer, andthe rest (e.g., first touch electrode X-TE, second touch electrode Y-TE, first bridge pattern X-CL) may be disposed on the second touchsensor metal layer positioned over the first touch sensor metal layer.The touch sensor layer 360 may further include an interlayer insulatinglayer ILD positioned between the first touch sensor metal layer and thesecond touch sensor metal layer, and include a touch protection layerPAC positioned on the second touch sensor metal layer.

Since the light generating device 1200 is lower than the polarizingplate 370 formed on the touch sensor layer 360, the upper space 1314 ofthe light generating device 1200 corresponds to a hole of the polarizingplate 370.

FIG. 14 is a view showing a heterogeneous cathode electrode layer 340 ofthe display device 10 according to embodiments of the presentdisclosure.

Referring to FIG. 14 , the heterogeneous cathode electrode layer 340includes a first cathode electrode CE1 and a second cathode electrodeCE2.

The first cathode electrode CE1 may be disposed in the first area A1 andmay have a first transmittance equal to or greater than a predeterminedthreshold transmittance. Here, the first area A1 may overlap the opticaldevice (e.g., camera 110, proximity sensor 120, etc.) and may be a partof the display area AA. The predetermined threshold transmittance may bea minimum transmittance value that allows the functions of the camera110 and the proximity sensor 120 to be normally performed.

The second cathode electrode CE2 may be disposed in the second area A2different from the first area A1 in the display area AA, and may have asecond transmittance different from the first transmittance of the firstcathode electrode CE1. Here, the second transmittance may be lower thanthe first transmittance, and may be less than the predeterminedthreshold transmittance.

The first cathode electrode CE1 may be a transparent electrode havingthe first transmittance higher than the second transmittance. Forexample, the first cathode electrode CE1 may include one or more of IZO(Indium Zinc Oxide), ITO (Indium Tin Oxide), ZnO (Zinc Oxide), Ba/Ag,Ca/Ag, graphene, silver nanowire, and carbon nanotubes, and the like.

The second cathode electrode CE2 may be a semi-transparent electrodehaving the second transmittance lower than the first transmittance. Forexample, the second cathode electrode CE2 may include one or more of Mg,Ag, or the like.

FIGS. 15 and 16 are exemplary views illustrating arrangement structuresof subpixels SP in the first area A1 and arrangement structures ofsubpixels SP in the second area A2 in the display panel 100 of thedisplay device 10 according to embodiments of the present disclosure.

Referring to FIGS. 15 and 16 , a plurality of subpixels SP may include ared subpixel R emitting red light, a green subpixel G emitting greenlight, and a blue subpixel emitting blue light B.

Each of the plurality of subpixels SP may have a shape of a rectangle, apolygon, a circle, an oval, etc. The plurality of subpixels SP may bearranged in a stripe form as shown in FIG. 15 or may be arranged in adot form as shown in FIG. 16 .

Referring to FIGS. 15 and 16 , among the first area A1 and the secondarea A2 constituting the display area AA, the first area A1 may have alower resolution than the resolution of the second area A2. The firstarea A1 may correspond to the camera area and/or the proximity sensingarea, or overlap the camera area and/or the proximity sensing area, orinclude the camera area and/or the proximity sensing area.

Referring to FIGS. 15 and 16 , the number of subpixels SP per unit areain the first area A1 may be less than the number of subpixels SP perunit area in the second area A2.

Referring to FIGS. 15 and 16 , subpixels SP disposed in the first areaA1 may constitute subpixel clusters SPG including two or more subpixelsSP.

The separation distance D between the subpixel clusters SPG may begreater than the separation distance between two or more subpixels SPincluded in each of the subpixel clusters SPG.

Referring to FIGS. 15 and 16 , even if fewer sub-pixels SP are arrangedin the first area A1 than the second area A2, metal patterns such as thedata lines DL, the gate line GL, and the anode electrode AE for drivinga small number of sub-pixels SP may be disposed in the first area A1.This may slightly degrade the transmittance performance of the firstarea A1. To compensate for this, subpixel clusters SPG in the first areaA1 may be regularly arranged.

Accordingly, a decrease in transmittance performance of the first areaA1 may occur regularly and fairly throughout the first area A1.Therefore, a large drop in the shooting performance of the camera 110 orthe sensing performance of the proximity sensor 120 can be prevented.

Referring to FIGS. 15 and 16 , for example, in each of the subpixelclusters SPG, the number of green subpixels G may be greater than thenumber of blue subpixels B and the number of red subpixels R. Forexample, in FIG. 15 , each subpixel cluster SPG may include one bluesubpixel B, one red subpixel R, and two green subpixels G. In FIG. 16 ,each subpixel cluster SPG may include two blue subpixels B, two redsubpixels R, and four green subpixels G.

Below, cross-sectional structures of areas X, Y, and Z in FIG. 16 willbe described with reference to FIGS. 17 to 20 . The area X is a subpixelarea in which the subpixel SP is disposed in the second area A2. Thearea Y is a subpixel area in which the subpixel SP is disposed in thefirst area A1. The area Z is a non-subpixel area in which the subpixelSP is not disposed in the first area A1. However, in FIGS. 17 to 20 ,the driving transistor DRT has a top gate structure.

FIG. 17 is a cross-sectional view of a subpixel area X in the secondarea A2 in the display panel 100 of the display device 10 according toembodiments of the present disclosure.

Referring to FIG. 17 , a multi-buffer layer MULTI-BUF and anactive-buffer layer ACT-BUF may be disposed on the transparent substrate320. The active layer ACT may be disposed on the active-buffer layerACT.

The gate insulating layer GI may be disposed on the active layer ACT.The first node electrode NE1 corresponding to the gate electrode isdisposed on the gate insulating layer GI. The insulating layer INS maybe disposed while covering the first node electrode NE1. Theintermediate layer INT may be disposed on the insulating layer INS. Atriple contact hole of the intermediate layer INT, the insulating layerINS, and the gate insulating layer GI may be formed.

A second node electrode NE2 and a third node electrode NE3 made of asource-drain material may be disposed on the intermediate layer INT. Thesecond node electrode NE2 and the third node electrode NE3 may contactthe active layer ACT through a triple contact hole of the intermediatelayer INT, the insulating layer INS, and the gate insulating layer GI.

A channel may be formed in an area of the active layer ACT that overlapswith the first node electrode NE1 corresponding to the gate electrode.The area of the active layer ACT that does not overlap the first nodeelectrode NE1 may be a conductor area.

In FIG. 17 , the active layer ACT, the first node electrode NE1, thesecond node electrode NE2, and the third node electrode NE3 may form adriving transistor DRT. In this case, the first node electrode NE1 is agate electrode of the driving transistor DRT, the second node electrodeNE2 is a source electrode or a drain electrode of the driving transistorDRT, the third node electrode NE3 is a drain electrode or a sourceelectrode of the driving transistor DRT, and the active layer ACT may bean active layer of the driving transistor DRT.

Referring to FIG. 17 , a planarization layer PLN may be disposed on thesecond node electrode NE2 and the third node electrode NE3. The anodeelectrode AE may be disposed on the planarization layer PLN. The anodeelectrode AE may be connected to the second node electrode NE2 (or thethird node electrode NE3) of the driving transistor DRT through thecontact hole of the planarization layer PLN.

Referring to FIG. 17 , the display panel 100 may further include a bankBANK disposed on the planarization layer PLN on which the anodeelectrode AE is formed. The bank BANK may define a light emitting areaof each subpixel SP. The bank BANK may overlap a portion of the anodeelectrode AE, and may overlap a portion of the planarization layer PLN.

The display panel 100 may further include a spacer SPC disposed on thebank BANK.

In the area where the bank BANK is opened, the light emitting layer ELmay be disposed on the exposed portion of the anode electrode AE. Thesecond cathode electrode CE2 having the second transmittance may bedisposed on the emission layer EL.

The second cathode electrode CE2 disposed in the second area A2 amongthe first cathode electrode CE1 and the second cathode electrode CE2included in the heterogeneous cathode electrode layer 340 may be asemi-transparent cathode electrode and may have a second transmittance.The second transmittance may be less than the predetermined thresholdtransmittance. The predetermined threshold transmittance may be aminimum transmittance that allows the functions of the camera 110 andthe proximity sensor 120 to be normally performed.

An encapsulation layer 350 including a first inorganic encapsulationlayer PAS1, an organic encapsulation layer PCL, a second inorganicencapsulation layer PAS2, and the like may be disposed on the secondcathode electrode CE2.

FIG. 18 is a cross-sectional view of a subpixel area Y in the first areaA1 in the display panel 100 of the display device 10 according toembodiments of the present disclosure.

Referring to FIG. 18 , a multi-buffer layer MULTI-BUF and anactive-buffer layer ACT-BUF may be disposed on the transparent substrate320. The active layer ACT may be disposed on the active-buffer layerACT-BUF.

A gate insulating layer GI may be disposed on the active layer ACT. Thefirst node electrode NE1 corresponding to the gate electrode may bedisposed on the gate insulating layer GI. The insulating layer INS maybe disposed while covering the first node electrode NE1. Theintermediate layer INT may be disposed on the insulating layer INS. Atriple contact hole of the intermediate layer INT, the insulating layerINS, and the gate insulating layer GI is formed.

A second node electrode NE2 and a third node electrode NE3 made of asource-drain material may be disposed on the intermediate layer INT. Thesecond node electrode NE2 and the third node electrode NE3 may becontacted to the active layer ACT through a triple contact hole formedin the intermediate layer INT, the insulating layer INS, and the gateinsulating layer GI.

A channel may be formed in an area of the active layer ACT that overlapswith the first node electrode NE1 corresponding to the gate electrode.The area of the active layer ACT that does not overlap the first nodeelectrode NE1 may be a conductor area.

In FIG. 18 , the active layer ACT, the first node electrode NE1, thesecond node electrode NE2, and the third node electrode NE3 may form adriving transistor DRT. In this case, the first node electrode NE1 is agate electrode of the driving transistor DRT, the second node electrodeNE2 is a source electrode or a drain electrode of the driving transistorDRT, the third node electrode NE3 is a drain electrode or a sourceelectrode of the driving transistor DRT, and the active layer ACT may bean active layer of the driving transistor DRT.

Referring to FIG. 18 , a planarization layer PLN may be disposed on thesecond node electrode NE2 and the third node electrode NE3. The anodeelectrode AE may be disposed on the planarization layer PLN. The anodeelectrode AE may be connected to the second node electrode NE2 (or thethird node electrode NE3) of the driving transistor DRT through thecontact hole of the planarization layer PLN.

Referring to FIG. 18 , the display panel 100 may further include a bankBANK disposed on the planarization layer PLN on which the anodeelectrode AE is formed. The bank BANK may define a light emitting areaof each subpixel SP. The bank BANK may overlap a portion of the anodeelectrode AE, and may overlap a portion of the planarization layer PLN.

The display panel 100 may further include a spacer SPC disposed on thebank BANK.

In the area where the bank BANK is open, the light emitting layer EL maybe disposed on the exposed portion of the anode electrode AE. A firstcathode electrode CE1 having a first transparency may be disposed on theemission layer EL.

The second cathode electrode CE2 disposed in the second area A2 amongthe first cathode electrode CE1 and the second cathode electrode CE2included in the heterogeneous cathode electrode layer 340 may be atransparent cathode electrode and may have a first transmittance. Thefirst transmittance may be equal to or greater than the predeterminedthreshold transmittance. The predetermined threshold transmittance maybe a minimum transmittance that allows the functions of the camera 110and the proximity sensor 120 to be normally performed.

An encapsulation layer 350 including a first inorganic encapsulationlayer PAS1, an organic encapsulation layer PCL, a second inorganicencapsulation layer PAS2, and the like may be disposed on the firstcathode electrode CE1.

Referring to FIG. 18 , the bank BANK defines a light emitting area ofeach of the plurality of subpixels SP, and may be positioned between theanode electrode layer 332 and the heterogeneous cathode layer 340. Theanode electrode layer 332 may include an anode electrode AE disposed oneach of the plurality of subpixels SP.

Referring to FIG. 18 , the spacer SPC is disposed in a boundary areabetween the first area A1 and the second area A2 and may be located onthe bank BANK. The boundary point BRD of the first cathode electrode CE1disposed in the first area A1 and the second cathode electrode CE2disposed in the second area A2 may be located on the spacer SPC.

FIG. 19 is a cross-sectional view of a non-subpixel area Z in the firstarea A1 in the display panel 100 of the display device 10 according toembodiments of the present disclosure.

Referring to FIG. 19 , the first area A1 may include a non-subpixel areaZ. The non-subpixel area Z is a space between subpixel clusters SPG, andmay be an area in which the subpixel SP is not disposed.

In the non-subpixel area Z in which the subpixel SP does not exist,transistors (DRT, SCT, etc.), storage capacitor Cst, anode electrode AE,the light emitting layer EL and the like are not disposed. However, thefirst cathode electrode CE1 having the first transmittance may exist inthe non-subpixel area Z.

Referring to FIG. 19 , a multi-buffer layer MULTI-BUF and anactive-buffer layer ACT-BUF may be disposed on the transparent substrate320. The active layer ACT may be disposed on the active-buffer layerACT.

A gate insulating layer GI may be disposed on the active layer ACT. Aninsulating layer INS may be disposed on the gate insulating layer GI.The intermediate layer INT may be disposed on the insulating layer INS.

The planarization layer PLN may be disposed on the intermediate layerINT. A bank BANK may be disposed on the planarization layer PLN. Thefirst cathode electrode CE1 having the first transmittance may bedisposed on the bank BANK.

An encapsulation layer 350 including a first inorganic encapsulationlayer PAS1, an organic encapsulation layer PCL, a second inorganicencapsulation layer PAS2, and the like may be disposed on the firstcathode electrode CE1.

FIG. 20 is a view for explaining a principle of designing an area of thefirst area A1 for a photographing function of the camera 110 positionedunder the display panel 100 in the display device 10 according toembodiments of the present disclosure.

Referring to FIG. 20 , and referring to Equation 1 below, the area (S)of the first area A1 may be equal to or greater than a square of a value(B= 2 × H × tan (θ/2)) calculated by multiplying a value (2H) obtainedby doubling a depth (H) of the light incident part IA and a tangentvalue (tan (θ/2)) for 1/2 of the angle (θ) of view of the camera 110.Here, the depth H of the light incident part IA may correspond to adistance from the camera 110 to the front surface of the display device10. The calculation method for the area S of the first area A1 usingEquation 1 below may be suitable when the first area A1 has arectangular shape on a plane. S ≥ B², B = 2 × H × tan (θ/2) ......(Equation 1)

In a different way, the area (S) of the first area A1 may be equal to orgreater than a circle area having a radius (R = H × tan (θ/2))calculated by multiplying the depth (H) of the light incident part IA bya tangent value (tan (θ/2)) for 1/2 of the angle (θ) of view of thecamera 110. Here, the depth (H) of the light incident part IA maycorrespond to a distance from the camera 110 to the front surface of thedisplay device 10. This area calculation method may be suitable when thefirst area A1 has a circular shape on a plane.

FIG. 21 is a cross-sectional view illustrating components of thefingerprint sensing part in the display device 10 according toembodiments of the present disclosure.

Referring to FIG. 21 , the fingerprint sensor panel 300 included in thedisplay device 10 according to embodiments of the present disclosure maybe located under the back plate 310 positioned under the transparentsubstrate 320. Here, the back plate 310 may have a transmittance equalto or greater than the predetermined threshold transmittance. Thepredetermined threshold transmittance may be a minimum transmittancethat allows the functions of the camera 110 and the proximity sensor 120to be normally performed.

The fingerprint sensor panel 300 may include a plurality of fingerprintsensor blocks (SB).

The fingerprint sensor panel 300 may have a hole or notch groove 500positioned in a portion corresponding to the first area A1. The cushionplate 306 positioned under the fingerprint sensor panel 300 may have ahole or notch groove 500 positioned in a portion corresponding to thefirst area A1.

Referring to FIG. 21 , the fingerprint sensor panel 300 may include asubstrate 2110, a fingerprint transistor array 2120, a piezoelectricmaterial layer 2130, and a common electrode 2140. The substrate 2110 maybe disposed under the transparent substrate 320 and may have the hole ornotch groove 500 in a portion corresponding to the first area A1. Thefingerprint transistor array 2120 may be disposed on the substrate 2110and may include transistors disposed on each of a plurality offingerprint sensor blocks SB. The piezoelectric material layer 2130 maybe disposed under the fingerprint transistor array 2120. The commonelectrode 2140 may be disposed under the piezoelectric material layer2130.

Referring to FIG. 21 , the fingerprint sensor panel 300 may furtherinclude a protective layer 2150 covering the common electrode 2140.

Referring to FIG. 21 , the fingerprint sensor panel 300 may include afingerprint pad unit 521. The fingerprint pad unit 521 may include afingerprint pad unit 521A to which the fingerprint driving circuit 520is electrically connected, and a fingerprint pad unit 521B to which theflexible printed circuit 2160 is electrically connected.

The fingerprint driving circuit 520 may be implemented in the form of anIC chip to be electrically connected to the fingerprint pad unit 521A ofthe fingerprint sensor panel 300. Alternatively, the fingerprint drivingcircuit 520 may be mounted on the flexible printed circuit 2160electrically connected to the fingerprint pad unit 521B of thefingerprint sensor panel 300.

Referring to FIG. 21 , the common electrode 2140 may be connected to thepad 2141 of the fingerprint sensor panel 300. Here, a common voltage maybe applied to the pad 2141.

Referring to FIG. 21 , the fingerprint transistor array 2120 may includedriving electrodes disposed for each fingerprint sensing pixel FP-PXL.The driving electrode may be one electrode (source electrode or drainelectrode) of the transistor in each fingerprint sensing pixel FP-PXL,or a pattern electrically connected to one electrode of the transistor.

One of the driving electrode and the common electrode 2140 may beapplied with a signal (AC signal) having a voltage level fluctuation,and the other may be applied with a signal (DC signal) having a constantvoltage level. For example, a common signal in the form of a DC voltagemay be applied to the common electrode 2140, and a drive signal in theform of an AC signal may be applied to the driving electrode.

FIGS. 22 and 23 are plan views illustrating components of thefingerprint sensing part of the display device 10 according toembodiments of the present disclosure.

Referring to FIGS. 22 and 23 , the camera 110 and the proximity sensor120 may be positioned under the display panel 100 and are located in thefirst area A1 in the display area AA. The fingerprint sensor panel 300may be located on the side of the camera 110 and the proximity sensor120. In addition, the fingerprint sensor panel 300 should be capable ofsensing the fingerprint on the front surface.

Therefore, the fingerprint sensor panel 300 and the substrate 2110included in the fingerprint sensor panel 300 may have a hole or a notchgroove 500 at a position corresponding to the first area A1.

For example, referring to FIG. 22 , the first area A1 may be located inthe display area AA, but may be located in a boundary area adjacent tothe non-display area located outside the display area AA. That is, thefirst area A1 is surrounded by the second area A2 only in somedirections. For example, when the shape of the first area A1 is a squarehaving four sides, three sides of the first area A1 are surrounded bythe second area A2, and one side of the first areas A1 is not surroundedby the second area A2. In this case, as shown in FIG. 22 , thefingerprint sensor panel 300 and the substrate 2110 included in thefingerprint sensor panel 300 may have a notch groove 500 at a positioncorresponding to the first area A1.

As another example, referring to FIG. 23 , the first area A1 may belocated in the center of the display area AA. That is, the first area A1is surrounded by the second area A2 in all directions. For example, whenthe shape of the first area A1 is a square having four sides, the foursides of the first area A1 are surrounded by the second area A2. In thiscase, as illustrated in FIG. 23 , the fingerprint sensor panel 300 andthe substrate 2110 included in the fingerprint sensor panel 300 may havea hole 2300 at a position corresponding to the first area A1.

The fingerprint sensor panel 300 may sense fingerprints on all areas ofthe display panel 100. As described above, in order to sensefingerprints in all areas, in the fingerprint sensor panel 300, theplurality of fingerprint sensor blocks SB may be disposed to correspondto all other areas (i.e., the second area A2) except for the first areaA1 in the display area AA of the display panel 100.

Referring to FIGS. 22 and 23 , the flexible printed circuit 2160 may beconnected to the substrate 2110, but may be connected to the oppositeside of the position corresponding to the first area A1 (i.e., theopposite side of the notch groove 500).

FIG. 24 is a view showing a scan driving of the fingerprint sensor panel300 of the display device 10 according to embodiments of the presentdisclosure.

Referring to FIG. 24 , the fingerprint sensor panel 300 may include m^(∗) n fingerprint sensor blocks (SB (1, 1), SB (1, 2), ... , SB (1, n),SB (2,1), SB (2 , 2), ... , SB (2, n), ... , SB (m, 1), SB (m, 2), ... ,SB (m, n)). The m ^(∗) n fingerprint sensor blocks (SB (1, 1) ~ SB (m,n)) may be arranged in m rows and n columns. Here, m may be a naturalnumber of 1 or more, and n may be a natural number of 1 or more.

Referring to FIG. 24 , m ^(∗) n fingerprint sensor blocks SB (1, 1) toSB (m, n) may each include k ^(∗) k fingerprint sensing pixels FP-PXL.That is, each of m ^(∗) n fingerprint sensor blocks SB (1, 1) to SB (m,n) may include fingerprint sensing pixels FP-PXL in k rows and kcolumns. Here, k is a natural number of 1 or more.

Referring to FIG. 24 , m ^(∗) k scan lines (SCL 1-1, SCL 1-2, ... , SCL1-k, SCL 2-1, SCL 2-2, ... , SCL 2-k, ... , SCL m-1, SCL m-2, ... , SCLm-k) for transferring the scan signal (SC 1-1, SC 1-2, ... , SC 1-k, SC2-1, SC 2-2, ... , SC 2-k, ... , SC m-1, SC m-2, ... , SC m-k) to mfingerprint sensor block rows may be disposed on the substrate 2110 ofthe fingerprint sensor panel 300. The n ^(∗) k read-out lines RL forsensing a signal for sensing a fingerprint in n fingerprint sensor blockcolumns may be disposed on the substrate 2110 of the fingerprint sensorpanel 300.

As shown in FIG. 24 , the notch groove 500 may exist in an area(corresponding to A1) in which one or more fingerprint sensor block rowsamong m fingerprint sensor block rows are disposed. In some cases, thehole 2300 may exist instead of the notch groove 500 in an area(corresponding to A1) in which one or more fingerprint sensor block rowsamong m fingerprint sensor block rows are disposed.

Referring to FIG. 24 , the fingerprint sensor panel 300 may furtherinclude a plurality of scan driving blocks (SDB 1-1, SDB 1-2, SDB 2,..., SDB m) corresponding to m fingerprint sensor block rows. Forexample, a plurality of scan driving blocks (SDB 1-1, SDB 1-2, SDB 2,..., SDB m) may be a GIP (Gate In Panel) type circuit.

The substrate 2110 may include a fingerprint sensor area FSA and anouter area disposed outside the fingerprint sensor area FSA. Theplurality of scan driving blocks (SDB 1-1, SDB 1-2, SDB 2, ..., SDB m)may be disposed in the outer area of the fingerprint sensor area FSA inthe substrate 2110. The fingerprint transistor array 2120 may bedisposed on the fingerprint sensor area FSA of the substrate 2110.

Each of the plurality of scan driving blocks (SDB 1-1, SDB 1-2, SDB 2,..., SDB m) may output k scan signals. For example, the first scandriving blocks (SDB 1-1, SDB 1-2) output k scan signals (SC 1-1, SC 1-2,..., SC 1-k) to the fingerprint sensor block row (SB (1, 1), ... , SB(1, n)) of the first row. The second scan driving block (SDB 2) outputsk scan signals (SC 2-1, SC 2-2, ..., SC 2-k) to the fingerprint sensorblock row (SB (2, 1), ... , SB (2, n))of the second row. The m-th scandriving block (SDB m) outputs k scan signals (SC m-1, SC m-2, ..., SCm-k) to the fingerprint sensor block row (SB (m, 1), ... , SB (m, n))ofthe m-th row.

Referring to FIG. 24 , a plurality of scan drive blocks (SDB 1-1, SDB1-2, SDB 2, ..., SDB m) may include one or more first scan drive blocksSDB 1-1 positioned on one side of the notch groove 500 (or the hole2300) and one or more second scan driving blocks SDB 1-2 positioned onthe other side of the notch groove 500 (or hole 2300 instead of notchgroove 500).

Referring to FIG. 24 , the plurality of scan lines SCL may include aplurality of first scan lines SCL corresponding to the one or more firstscan drive blocks SDB 1-1 and a plurality of second scan line SCLcorresponding to one or more second scan drive blocks SDB 1-2. The oneor more first scan driving blocks SDB 1-1 output k scan signals (SC 1-1,SC 1-2, ..., SC 1-k) to a plurality of first scan lines SCL. The k scansignals (SC 1-1, SC 1-2, ..., SC 1-k) can be transferred to one or morefirst fingerprint sensor block row (SB (1,1), SB (1,2), ...) through aplurality of first scan line (SCL). The one or more first fingerprintsensor block rows (SB (1,1), SB (1,2), ...) may be located at one sideof the notch groove 500 or the hole 2300. The one or more second scandriving blocks SDB 1-2 output k scan signals (SC 1-1, SC 1-2, ..., SC1-k) to the plurality of second scan lines SCL. The k scan signals (SC1-1, SC 1-2, ..., SC 1-k) can be transferred to one or more secondfingerprint sensor block row (..., SB (1, n)) through a plurality ofsecond scan line (SCL). The one or more second fingerprint sensor blockrows (..., SB (1, n)) may be located on the other side of the notchgroove 500 or the hole 2300.

Referring to FIG. 24 , the fingerprint sensing part of the displaydevice 10 according to embodiments of the present disclosure may furtherinclude a gate controller 2400. The gate controller 2400 may supply astart signal (VST(1), VST(2), ... , VST(m)), a reset signal (Vrst), aclock signal (CLK1,2), a VSS voltage, and a VDD voltage to the pluralityof scan driving blocks (SDB 1-1, SDB 1-2, SDB 2, ... , SDB m).

Referring to FIG. 24 , in the fingerprint sensor panel 300, k read-outlines RL corresponding to each of the n fingerprint sensor block columnsmay be disposed.

Referring to FIG. 24 , the fingerprint driving circuit 520 connected tothe fingerprint sensor panel 300 may include n multiplexers MUX 1 to MUXn corresponding to each of the n fingerprint sensor block rows, and nanalog-to-digital converters ADC connected to the output nodes of the nmultiplexers MUX 1 to MUX n. The fingerprint driving circuit 520 maygenerate fingerprint sensing data including digital values (sensingvalues) output from n analog-to-digital converters ADC.

Each of the n multiplexers MUX 1 to MUX n can select one of the kread-out lines RL and connect the selected read-out line RL to theanalog-to-digital converter ADC through its output node. The k read-outlines RL may correspond to k fingerprint sensing pixels FP-PXL disposedon a selected line (fingerprint sensing pixel row).

Referring to FIG. 24 , the fingerprint driving circuit 510 and the gatecontroller 2400 may be mounted on the flexible printed circuit 2160.

Meanwhile, when the hole 2300 is located in the central portion 2402 ofthe fingerprint sensor panel 300, the plurality of read-out lines RL mayinclude at least one read-out line RL arranged in a column directionwhile bypassing one side of the hole 2300.

FIG. 25 is an example of an equivalent circuit of the fingerprintsensing pixel in the fingerprint sensor panel 300 of the display device10 according to embodiments of the present disclosure.

Referring to FIG. 25 , a fingerprint sensing pixel FP-PXL disposed onthe fingerprint sensor panel 300 of the display device 10 according toembodiments of the present disclosure may include: a transducer TRDSincluding a driving electrode DE, a piezoelectric material layer 2130,and a common electrode 2140; a transmission part TX-PART configured tobe a part operating in the driving mode (transmission mode); and areceiving part RX-PART configured to be a part operating in the sensingmode (receiving mode). The transmission part TX-PART may transmit thedriving signal DS to the driving electrode DE of the transducer TRDS.The receiving part RX-PART may allow the fingerprint driving circuit 520to detect an electrical signal (sensing signal) through the read-outline RL. The term “driving” related to fingerprint sensing may be usedin the same sense as “transmission (TX)”, and “sensing” may be used inthe same sense as “reception (RX, Reception).”

As described above, the transducer TRDS may include a driving electrodeDE, a piezoelectric material layer 2130, and a common electrode 2140.

In the transducer TRDS, the driving electrode DE is an electrode towhich the driving signal DS can be applied through the transmission partTX-PART. The driving electrode DE corresponds to the driving node Nd.The common electrode 2140 may receive a bias voltage GB corresponding toa common voltage.

For example, the driving signal DS applied to the driving electrode DEmay be a signal having a predetermined amplitude (ΔV) and a voltagelevel change, and may be in the form of an AC signal (also referred toas a pulse signal or a modulation signal). The driving signal DS mayhave various waveforms such as a square wave, a sinusoidal wave, and atriangular wave.

The driving signal DS may be a signal supplied to one or morefingerprint sensing pixels to be driven among the plurality offingerprint sensing pixels FP-PXL.

In this specification, the signal applied to the common electrode 2140is referred to as a bias voltage (GB). The bias voltage GB may be adifferent voltage from the driving signal DS applied to the drivingelectrode DE. The bias voltage GB may be a DC voltage. For example, thebias voltage GB may be a DC voltage of a predetermined low voltagelevel.

When a driving signal DS in the form of an AC signal having apredetermined frequency is applied to the driving electrode DE and abias voltage GB in the form of a DC signal having a low DC voltage levelis applied to the common electrode 2140, the piezoelectric materiallayer 2130 may vibrate to generate a signal. For example, the signalgenerated from the transducer TRDS may be electromagnetic waves, or maybe ultrasonic waves or sound waves.

Here, for example, when sound waves are generated from the transducerTRDS, the sound waves may have a range of approximately 16 Hz to 20 KHz.In addition, for example, when ultrasonic waves are generated from thetransducer TRDS, the ultrasonic waves may have a frequency of 20 KHz ormore. That is, ultrasonic waves generated by the transducer TRDS mayhave a period of 50 µsec or less.

For example, the above-mentioned piezoelectric material layer 2130 maybe composed of one or more of ZnO (Zinc Oxide), Perovskite, etc. Inaddition, various piezoelectric materials may be used. Hereinafter, forconvenience of description, it is assumed that the signal generated bythe transducer TRDS is ultrasonic.

The above-described transducer TRDS may be a type of energy conversiondevice or/and signal generating device that converts and generateselectrical energy into a signal of another energy type, and when asignal is received, converts the received signal into an electricalenergy type signal. For example, the transducer TRDS may be anultrasonic transducer that generates ultrasonic waves (energy typesignal different from electrical energy type) according to electricalenergy applied to the driving electrode DE, and generates electricalenergy when ultrasonic waves are received.

More specifically, in the transducer TRDS, when a driving signal DS inthe form of an AC signal is applied to the driving electrode DE and abias voltage GB having a low DC voltage level is applied to the commonelectrode 2140, the piezoelectric material layer 2130 can vibrate byvoltages DS and GB applied to the driving electrode DE and the commonelectrode 2140, and can convert electrical energy by voltages DS and GBapplied to the driving electrode DE and the common electrode 2140 intoultrasonic waves, and can generate ultrasonic waves to the outside.Here, the vibration of the piezoelectric material layer 2130 may meanthat the polarization state of the piezoelectric material layer 2130changes.

Then, in the transducer TRDS, when the ultrasonic wave is received bythe piezoelectric material layer 2130, the piezoelectric material layer2130 may vibrate according to the received ultrasonic waves and convertthe received ultrasonic waves into voltages in the form of electricalenergy. Here, the voltage converted into the form of electrical energymay be generated at the driving electrode DE. Here, the vibration of thepiezoelectric material layer 2130 may mean that the polarization stateof the piezoelectric material layer 2130 changes.

The transmission part TX-PART may be a circuit part that enables asignal (e.g., ultrasonic wave) to be generated in the transducer TRDS inthe driving mode (transmission mode).

The transmission part TX-PART may be controlled by the first scan signalSC (n) supplied through the first scan line SCL (n). The transmissionpart TX-PART may include a transmission transistor TXT electricallyconnected between the driving node Nd and the driving line DRL. Thedriving line DRL may be a line to which the driving signal DS having avoltage level change is supplied. Hereinafter, in consideration of theorder of scanning, the first scan line and the first scan signal arereferred to as an nth scan line (SCL (n)) and an nth scan signal (SC(n)).

The transmission transistor TXT may be turned on or off by the nth scansignal SC (n) supplied through the nth scan line SCL (n).

When the transmission transistor TXT is turned on by the nth scan signalSC (n), the transmission transistor TXT may transmit the driving signalDS supplied from the driving line DRL to the driving electrode DE of thetransducer TRDS.

The reception part RX-PART may be a circuit part that allows a signal tobe detected through the read-out line RL in the sensing mode (receptionmode).

The receiving part RX-PART may include a first receiving transistor RXT1and a second receiving transistor RXT2 electrically connected betweenthe read-out line RL and the power line VL. Here, the power line VL maybe a line to which the power voltage VCC is applied. For example, thepower voltage VCC may be a DC voltage.

The first receiving transistor RXT1 and the second receiving transistorRXT2 may be connected in series between the read-out line RL and thepower line VL. The source node or drain node of the first receivingtransistor RXT1 and the drain node or source node of the secondreceiving transistor RXT2 may be electrically connected to each other.The gate node of the first receiving transistor RXT1 may be electricallyconnected to the driving node Ni, and the gate node of the secondreceiving transistor RXT2 may be electrically connected to the secondscan line SCL (n-1). Here, the point (node) to which the first receivingtransistor RXT1 and the second receiving transistor RXT2 are connectedis referred to as an intermediate node Ni.

The first receiving transistor RXT1 may be electrically connectedbetween the intermediate node Ni and the power line VL. The firstreceiving transistor RXT1 may be turned on or off by being controlledaccording to the voltage state of the driving electrode DE electricallyconnected to the gate node.

The second receiving transistor RXT2 may be electrically connectedbetween the intermediate node Ni and the read-out line RL, and becontrolled by the second scan signal SC (n-1) supplied through thesecond scan line SCL (n-1). The second receiving transistor RXT2 may beturned on or off according to the (n-1) scan signal SC (n-1) applied tothe gate node through the (n-1) th scan line SCL (n-1). Hereinafter,considering the order of scanning, the second scan line and the secondscan signal are referred to as an (n-1)th scan line SCL (n-1) and an(n-1)th scan signal SC (n-1).

In a situation in which the (n-1) th scan signal SC (n-1) of the turn-onlevel voltage is applied to the gate node of the second receivingtransistor RXT2, when the voltage fluctuation of the driving node Ndoccurs according to the first receiving transistor (RXT1) is turned on,the fingerprint driving circuit 520 and the power line VL may beelectrically connected.

Accordingly, the fingerprint driving circuit 520 may detect a powervoltage VCC or an electrical signal corresponding to the power voltageVCC as a sensing signal.

One fingerprint sensing pixel FP-PXL may operate in a driving mode(transmission mode) or may operate in a sensing mode (reception mode).

Referring to FIG. 25 , for example, the fingerprint sensing pixel FP-PXLmay operate in a sensing mode (reception mode) for a Tn-1 period.Accordingly, during the Tn-1 period, the (n-1) th scan signal SC (n-1)having the turn-on voltage level is applied to the gate node of thesecond receiving transistor RXT2 in the corresponding fingerprintsensing pixel FP-PXL. During the Tn-1 period, the correspondingfingerprint sensing pixel FP-PXL does not operate in the driving mode(transmission mode). Accordingly, the nth scan signal SC (n) having theturn-off voltage level may be applied to the gate node of thetransmission transistor TXT in the corresponding fingerprint sensingpixel FP-PXL.

During the Tn-1 period, when ultrasonic waves generated by otherfingerprint sensing pixels (FP-PXL) are reflected from the surroundingsand received by the corresponding fingerprint sensing pixels (FP-PXL),the piezoelectric material layer 2130 of the transducer TRDS vibrates,and a voltage fluctuation occurs in the driving electrode DE.Accordingly, the first receiving transistor RXT1 may be turned on.Accordingly, both the first and second receiving transistors RXT1 andRXT2 are turned on, so that the fingerprint driving circuit 520 detectsthe power voltage VCC of the power supply line VL through the read-outline RL as a sensing signal.

The fingerprint sensing pixel FP-PXL may operate in a driving mode(transmission mode) for a Tn period different from the Tn-1 period.Accordingly, during the Tn period, the nth scan signal SC (n) having aturn-on voltage level may be applied to the gate node of thetransmission transistor TXT in the fingerprint sensing pixel FP-PXL.However, during the Tn period, the corresponding fingerprint sensingpixel FP-PXL does not operate in the sensing mode (reception mode).Accordingly, a (n-1) scan signal SC (n-1) having a turn-off voltagelevel may be applied to the gate node of the second receiving transistorRXT2.

During the Tn period, the nth scan signal SC (n) having a turn-onvoltage level may be applied to the gate node of the transmissiontransistor TXT in the corresponding fingerprint sensing pixel FP-PXL, sothat the transmission transistor TXT is Turn-on. The driving signal DSmay be applied to the driving electrode DE of the transducer TRDSthrough the turned-on transmission transistor TXT. At this time, a biasvoltage GB may be applied to the common electrode 2140 of the transducerTRDS. Accordingly, the piezoelectric material layer 2130 between thedriving electrode DE and the common electrode 2140 may be vibrated, andultrasonic waves may be generated.

The nth scan line SCL (n) and the (n-1) th scan line SCL (n-1) may bedisposed corresponding to each pixel column. That is, when viewed in onefingerprint sensing pixel row, the nth scan line SCL (n) and the (n-1)th scan line SCL (n-1) may be disposed corresponding to each fingerprintsensing pixel.

Alternatively, each of the nth scan line SCL (n) and the (n-1) th scanline SCL (n-1) may be shared by two-pixel columns. That is, for example,the (n-1) scan line SCL (n-1) may be shared by a receiving part RX-PARTof the first fingerprint sensing pixel FP-PXL and a transmitting partTX-PART in another fingerprint sensing pixel FP-PXL adjacent to thereceiving part RX-PART of the first fingerprint sensing pixel FP-PXL.The nth scan line SCL (n) may be shared by a transmission part TX-PARTof the first fingerprint sensing pixel FP-PXL and a reception partRX-PART in another fingerprint sensing pixel FP-PXL adjacent to thetransmission part TX-PART of the first fingerprint sensing pixel FP-PXL.

FIG. 26 is a view showing driving electrodes, the piezoelectric materiallayer 2130, and the common electrode 2140 in the fingerprint sensorpanel 300 of the display device 10 according to embodiments of thepresent disclosure.

Referring to FIG. 26 , each fingerprint sensing pixel FP-PXL may includea transducer TRDS, and the transducer TRDS may include a drivingelectrode DE, a piezoelectric material layer 2130, and a commonelectrode 2140.

As illustrated in FIG. 26 , in the fingerprint sensor panel 300, thepiezoelectric material layer 2130 may be commonly disposed in all areasof the plurality of fingerprint sensing pixels FP-PXL in the form of oneplate.

Alternatively, in the fingerprint sensor panel 300, the piezoelectricmaterial layer 2130 may be divided and disposed to correspond to each ofthe plurality of fingerprint sensing pixels FP-PXL. That is, thepiezoelectric material layer 2130 may include a plurality of dividedpiezoelectric material layers. The division structure of thepiezoelectric material layer 2130 may be a structure more suitable for apartial sensing method. According to the partial sensing method, onlysome of the fingerprint sensing pixels PXL included in the fingerprintsensing pixel column to be sensed may be sensed. According to thepartial sensing method, power consumption can be reduced.

That is, the piezoelectric material layer 2130 may be formed on theentire surface without being divided, or may be divided and formed oneach fingerprint sensing pixel area.

As illustrated in FIG. 26 , the common electrode 2140 may be commonlydisposed in all areas of the plurality of fingerprint sensing pixelsFP-PXL in the form of one plate electrode.

Alternatively, the common electrode 2140 may be divided and arranged tocorrespond to each of the plurality of fingerprint sensing pixelsFP-PXL. The division structure of the common electrode 2140 may be astructure more suitable for the partial sensing method. According to thepartial sensing method, only some of the fingerprint sensing pixels PXLincluded in the fingerprint sensing pixel column to be sensed may besensed. According to the partial sensing method, power consumption canbe reduced.

In other words, the common electrode 2140 may be formed on the entiresurface without being divided, or may be divided and formed on eachfingerprint sensing pixel area.

FIGS. 27 to 29 are views exemplarily showing applications usingfull-area fingerprint sensing of the display device 10 according toembodiments of the present disclosure.

Referring to FIG. 27 , the display device 10 may register a user’sfingerprint in a specific area 2700 of the display panel 100. Thedisplay device 10 may provide unlocking processing of the display device10 through a fingerprint recognized through the specific area 2700.

Otherwise, referring to FIG. 27 , since the display device 10 providesfull-area fingerprint recognition processing, the display device 10 mayregister one or more fingerprints of a user in all areas of the displaypanel 100 and provide unlocking processing based on one or morefingerprints recognized in all areas of the display panel 100.

Referring to FIG. 28 , when a user touches numeric buttons (button 1,button 3, button 7, button 9) on the keyboard screen for unlocking tounlock, the display device 10 senses the numbers (1, 3, 7, 9)corresponding to the number buttons (button 1, button 3, button 7,button 9) touched by the user by sensing the touch position (touchcoordinate). Here, the unique touch location information for the numberbuttons (buttons 0~9) may be stored in advance. Also, the display device10 recognizes fingerprints of a user who touches numeric buttons (button1, button 3, button 7, and button 9).

The display device 10 may provide an unlocking process by combining thenumeric recognition results (1, 3, 7, 9) with the fingerprintrecognition results. Accordingly, the display device 10 can providehigher security.

Referring to FIG. 29 , in the display panel 100, applicationscorresponding to one or more fingerprint recognition locations may beset. For example, four positions P1, P2, P3, and P4 in the display panel100 may correspond to four applications (App1, App2, App3, and App4).

For example, if the user places the fingerprint on the location P1, thedisplay device 10 recognizes the fingerprint on the location P1. Thedisplay device 10 determines whether the recognized fingerprint is thesame as the previously registered fingerprint for the location P1. Whenit is determined that the recognized fingerprint and the pre-registeredfingerprint are the same, the display device 10 may control theapplication P1 corresponding to the location P1 to be executed. At thistime, without unlocking, the application Appl may be executed in thelock screen state. If it is determined that the recognized fingerprintand the pre-registered fingerprint are not the same, the display device10 may control that the application Appl corresponding to the locationP1 cannot be executed.

FIG. 30 is a diagram for describing local fingerprint sensing based ontouch sensing of the display device 10 according to embodiments of thepresent disclosure.

Referring to FIG. 30 , in order to increase the efficiency and speed offingerprint sensing, the fingerprint driving circuit 520 may performlocal driving and local sensing of the fingerprint sensor panel 300using the touch sensing result.

Referring to FIG. 30 , the fingerprint driving circuit 520 mayselectively drive one or more fingerprint sensor blocks SB correspondingto a touch position among a plurality of fingerprint sensor blocksincluded in the fingerprint sensor panel 300.

According to embodiments of the present disclosure, by arranging theoptical device under the display panel, it is possible to provide adisplay device having a design in which an optical device requiringlight reception is not exposed to the outside at all.

In addition, according to embodiments of the present disclosure, it ispossible to provide a display device in which one or more opticaldevices of a camera and a proximity sensor are disposed to overlap witha display area under a display panel. Accordingly, one or more opticaldevices can be prevented from being exposed to the outside of thedisplay device. Therefore, the user cannot visually identify one or moreoptical devices (or lenses thereof) of the camera and proximity sensor.

In addition, according to embodiments of the present disclosure, it ispossible to provide a display device that does not degrade theperformance of the optical device while preventing the optical devicefrom being exposed to the outside at all.

In addition, according to embodiments of the present disclosure, it ispossible to provide a display device having a structure that preventsthe optical device from being exposed to the outside withoutdeteriorating the performance and display performance of the opticaldevice.

In addition, according to embodiments of the present disclosure, it ispossible to provide a display device capable of sensing fingerprints inall or part of the display panel. Through this, various applicationsrelated to fingerprint recognition can be provided.

The above description has been presented to enable any person skilled inthe art to make and use the technical idea of the present disclosure,and has been provided in the context of a particular application and itsrequirements. Various modifications, additions and substitutions to thedescribed embodiments will be readily apparent to those skilled in theart, and the general principles defined herein can be applied to otherembodiments and applications without departing from the spirit and scopeof the present disclosure. The above description and the accompanyingdrawings provide an example of the technical idea of the presentdisclosure for illustrative purposes only. That is, the disclosedembodiments are intended to illustrate the scope of the technical ideaof the present disclosure. Thus, the scope of the present disclosure isnot limited to the embodiments shown, but is to be accorded the widestscope consistent with the claims. The scope of protection of the presentdisclosure should be construed based on the following claims, and alltechnical ideas within the scope of equivalents thereof should beconstrued as being included within the scope of the present disclosure.

What is claimed is:
 1. A display device comprising: a substratecomprising a display area configured to display an image, wherein thedisplay area comprises a first area capable of transmission and a secondarea different from the first area; a plurality of light emittingelements positioned in each of the first area and the second area; anencapsulation layer disposed on the plurality of light emittingelements; and a touch sensor layer disposed on the encapsulation layer,the touch sensor layer comprising a plurality of touch electrodes,wherein each of touch electrodes positioned in the first area among theplurality of touch electrodes comprises a mesh-type electrode having oneor more openings.
 2. The display device according to claim 1, furthercomprising: a transistor array positioned in the display area over thesubstrate, an anode electrode layer positioned on the transistor array;a light emitting layer positioned on the anode electrode layer; and aheterogeneous cathode electrode layer positioned on the light emittinglayer, the heterogeneous cathode electrode layer comprising a firstcathode electrode and a second cathode electrode different from thefirst cathode electrode, wherein the substrate is a transparentsubstrate, wherein the anode electrode layer, the light emitting layer,and the heterogeneous cathode electrode layer constitute the pluralityof light emitting elements, wherein the first cathode electrode isdisposed in the first area and the second cathode electrode is disposedin the second area, and wherein the first cathode electrode has a firsttransmittance and the second cathode electrode has a secondtransmittance lower than the first transmittance.
 3. The display deviceaccording to claim 1, further comprising: a polarizing plate disposed onthe touch sensor layer; an optical transparent adhesive disposed on thepolarizing plate; and a cover glass located on the optical transparentadhesive, wherein the polarizing plate comprises a first portioncorresponding to the first area and a second portion corresponding tothe second area, and wherein the first portion has a highertransmittance than the second portion.
 4. The display device accordingto claim 1, further comprising: an optical device positioned in thedisplay area under the substrate and overlapping the first area.
 5. Thedisplay device according to claim 4, wherein the optical devicecomprises at least one of a camera and a proximity sensor.
 6. Thedisplay device according to claim 1, further comprising: a lightgenerating device; and a proximity sensor configured to detect asurrounding human body or object using light emitted from the lightgenerating device, wherein the light generating device is located on theencapsulation layer and is located on a side of the touch sensor layer,and wherein the proximity sensor is located in the display area underthe substrate and overlaps the first area.
 7. The display deviceaccording to claim 1, further comprising: a fingerprint sensor paneldisposed under the substrate, the fingerprint sensor panel including aplurality of fingerprint sensor blocks, wherein the fingerprint sensorpanel comprises a hole or notch groove positioned in a portioncorresponding to the first area.
 8. The display device according toclaim 1, wherein the first area has a first resolution, the second areahas a second resolution, and the first resolution is less than thesecond resolution.
 9. The display device according to claim 1, whereinsubpixels disposed in the first area constitute subpixel clustersincluding two or more subpixels, and wherein a separation distancebetween the subpixel clusters is greater than a separation distancebetween two or more subpixels included in each of the subpixel clusters.10. The display device according to claim 1, wherein each openingcorresponds to a light emitting area of at least one subpixel.
 11. Adisplay device comprising: a substrate comprising a display areaconfigured to display an image, wherein the display area comprises afirst area capable of transmission and a second area different from thefirst area; a plurality of light emitting elements positioned in each ofthe first area and the second area; an encapsulation layer disposed onthe plurality of light emitting elements; a touch sensor layer disposedon the encapsulation layer, the touch sensor layer comprising aplurality of touch electrodes; and at least one dummy metal electricallydisconnected from the plurality of touch electrodes, the at least onedummy metal disposed in the first area.
 12. The display device accordingto claim 11, further comprising: a transistor array positioned in thedisplay area over the substrate, an anode electrode layer positioned onthe transistor array; a light emitting layer positioned on the anodeelectrode layer; and a heterogeneous cathode electrode layer positionedon the light emitting layer, the heterogeneous cathode electrode layercomprising a first cathode electrode and a second cathode electrodedifferent from the first cathode electrode, wherein the substrate is atransparent substrate, wherein the anode electrode layer, the lightemitting layer, and the heterogeneous cathode electrode layer constitutethe plurality of light emitting elements, wherein the first cathodeelectrode is disposed in the first area and the second cathode electrodeis disposed in the second area, and wherein the first cathode electrodehas a first transmittance and the second cathode electrode has a secondtransmittance lower than the first transmittance.
 13. The display deviceaccording to claim 11, further comprising: a polarizing plate disposedon the touch sensor layer; an optical transparent adhesive disposed onthe polarizing plate; and a cover glass located on the opticaltransparent adhesive, wherein the polarizing plate comprises a firstportion corresponding to the first area and a second portioncorresponding to the second area, and wherein the first portion has ahigher transmittance than the second portion.
 14. The display deviceaccording to claim 11, further comprising: an optical device positionedin the display area under the substrate and overlapping the first area.15. The display device according to claim 14, wherein the optical devicecomprises at least one of a camera and a proximity sensor.
 16. Thedisplay device according to claim 11, further comprising: a lightgenerating device; and a proximity sensor detecting a surrounding humanbody or object using light emitted from the light generating device,wherein the light generating device is located on the encapsulationlayer and is located on a side of the touch sensor layer, and whereinthe proximity sensor is located in the display area under the substrateand overlaps the first area.
 17. The display device according to claim11, further comprising: a fingerprint sensor panel disposed under thesubstrate, the fingerprint sensor panel including a plurality offingerprint sensor blocks, wherein the fingerprint sensor panelcomprises a hole or notch groove positioned in a portion correspondingto the first area.
 18. The display device according to claim 11, whereinthe first area has a first resolution, the second area has a secondresolution, and the first resolution is less than the second resolution.19. The display device according to claim 11, wherein subpixels disposedin the first area constitute subpixel clusters including two or moresubpixels, and wherein a separation distance between the subpixelclusters is greater than a separation distance between two or moresubpixels included in each of the subpixel clusters.
 20. The displaydevice according to claim 11, wherein each opening corresponds to alight emitting area of at least one subpixel.